Aehr Test Systems, Inc.

Aeha Test Systems

Paul W Burke

Jovan Jovanovic

Donald Paul Richmond, Ii

Scott E Lindsey

Mark Charles Carbone

Kenneth W Deboe

Frank Otto Uher

Thomas T Maenner

Patrick M Shepherd

James F Tomic

Long V Vu

Jeffrey L Tyson

Doan D Cao

Larry J Lape

Rhea J Posedel

James Wrenn

Carl N Buck

See-Hack Foo

Ernie Wang

An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.

Apparatus for testing electronic devices

A reusable carrier 10 for temporarily holding an integrated circuit 12 during burn-in and electrical test includes a base 14 and a lid 16 attached to the base 14 by hinges 18. A flexible substrate 19 is attached to the base 14. Alignment posts 20 have tapered surfaces 22 that engage corners 24 of the integrated circuit 12 to position the integrated circuit 12 precisely on upper surface 26 of the substrate 19. A spring-loaded latch 28 engages projection 30 in aperture 32 of the base 14 to hold the lid 16 closed over the integrated circuit 12. Electrically conductive traces 34 on the surface 26 have contact bumps which engage contact pads on the underside of the integrated circuit 12 to connect the integrated circuit 12 to peripheral contact pads 38 around edges 40 of the substrate 19. A spring 42 engages upper surface 43 of the integrated circuit 12 when the lid 16 is in its closed position over the integrated circuit 12, to provide a biasing force to urge the contact pads against the conductive traces 34 with sufficient force to insure a reliable electrical connection. For burn-in, the temporary package 10 containing the integrated circuit die 12 is now loaded into a socket 48 on a burn-in board 50, which is then loaded into a burn-in system, where otherwise standard burn-in is performed.

Reusable die carrier for burn-in and burn-in process

Growing community of inventors

Hayward, CA, United States of America

Paul W Burke