Advanced Micro Devices Corporation

Paul W Ackmann

Richard David Edwards

Stuart E Brown

Khanh B Nguyen

Stu Brown

Harry Jay Levinson

Anthony John Toprac

Anastasia Lynn Oshelski

Anastasia L Osheiski

The present invention provides for a method and an apparatus for implementing programmed latency for improved wafer-to-wafer uniformity. Semiconductor devices for wafer-by-wafer analysis are identified. At least one value of a controlled variable in the wafer-by-wafer analysis is identified. A trajectory of recipes for the identified semiconductor devices is created. A sequence analysis of wafer-to-wafer variations is performed using the trajectory of recipes upon the identified semiconductor devices. A latency control is performed in response to the sequence analysis. A feed-forward implementation of wafer-by-wafer latency control is performed using the trajectory of recipes upon the identified semiconductor devices.

Method and apparatus for programmed latency for improving wafer-to-wafer uniformity

A method for processing a semiconductor substrate is presented wherein an alignment mark is formed in an alignment mark area of the semiconductor substrate. The alignment mark area is contained within a window area of the semiconductor substrate. The upper surface of the semiconductor substrate within the window area is recessed below the upper surface of the semiconductor substrate outside of the window area, preferably by exposing the upper surface of the semiconductor substrate within the window area to an etchant. Such recession forms an alignment mark trench within the window area. Being substantially recessed below the original surface of the semiconductor substrate, an alignment mark formed in such a manner may be substantially protected from chemical-mechanical polishing damage during subsequent processing steps.

Method for reducing the susceptibility to chemical-mechanical polishing damage of an alignment mark formed in a semiconductor substrate

An alignment mark protection structure (,) is disclosed which is used to ensure an integrity of an alignment scheme for a substrate (,) which is to be subjected to lithographic processing. The alignment mark protection structure (,) comprises the substrate (,) and an alignment mark (,) associated with the substrate (,). The alignment mark (,) reflects an alignment light (,) which is then used to determine an optimum alignment between the substrate (,) and a lithographic mask (,). A cap (,) overlies the alignment mark (,) and is substantially transparent with respect to the alignment light (,). The cap (,) protects the underlying alignment mark (,) from lithographic process-induced damage during processing and thus reduces alignment light noise, thereby improving the alignment between a mask (,) and the substrate (,) and minimizing the registration error associated with overlying layers formed on the substrate (,).

Mark protection with transparent film

A method (,) of characterizing a lithographic printer includes the steps of printing a first and second pattern (,) on substrates (,) using a reticle (,) having a first and second orientation. The method (,) further includes measuring a critical dimension of the first and second pattens at two points (,) and determining an imaging system component of the critical dimension of the patterns at the two points (,). The method (,) may be further expanded to encompass substantially all the points within the image field.

Removal of reticle effect on critical dimension by reticle rotation

An automated data management system for enabling the analysis and control of the performance of photolithography steppers in a submicron fabrication facility disclosed. In a preferred embodiments, software running on each of a plurality of first personal computers (PCs), each of which is connected to one of a plurality of steppers, is used to append printer data generated by the steppers responsive to tests, performed therein to ASCII files associated with the steppers and subsequently to upload the ASCII files to a network drive at specified time intervals. Once the ASCII files have been uploaded to the VAX drive, the files may be accessed by a user outside the facility using a second PC on which is running a utility of the present invention for providing automated analysis of the data for a particular stepper as requested by a user. In one aspect of the invention, the utility of the present invention comprises a windows-based user interface for enabling the user to select and initiate analysis procedures by selecting from a variety of options displayed on the user's PC. In another aspect of the invention, the utility of the present invention enables the user to select from among a variety of formats, including browse tables, charts and graphs, for viewing the resulting analysis data.

Automated data management system for analysis and control of

An automated data management system for enabling the analysis and control of the performance of photolithography steppers in a submicron fabrication facility is disclosed. In a preferred embodiments, software running on each of a plurality of first personal computers (PCs), each of which is connected to one of a plurality of steppers, is used to append printer data generated by the steppers responsive to tests performed therein to ASCII files associated with the steppers and subsequently to upload the ASCII files to a network drive at specified time intervals. Once the ASCII files have been uploaded to the VAX drive, the files may be accessed by a user outside the facility using a second PC on which is running a utility of the present invention for providing automated analysis of the data for a particular stepper as requested by a user. In one aspect of the invention, the utility of the present invention comprises a windows-based user interface for enabling the user to select and initiate analysis procedures by selecting from a variety of options displayed on the user's PC. In another aspect of the invention, the utility of the present invention enables the user to select from among a variety of formats, including browse tables, charts and graphs, for viewing the resulting analysis data.

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Buda, TX, United States of America

Paul W Ackmann