Lexmark International, Inc.

Paul Timothy Spivey

Carl Edmond Sullivan

Jeanne Marie Saldanha Singh

Melissa Marie Waldeck

Richard Earl Corley, Jr

Frank Edward Anderson

Sean Terrance Weaver

Gary Raymond Williams

Mary Claire Smoot

Craig Michael Bertelsen

Kin Ming Kwan

Jeanne M Saldanha Singh

Kris Ann Reeves

Ashok Murthy

Girish Shivaji Patil

Kent Lee Ubellacker

Jon Brock Whitney

Dell T Rosa

William Bruce Rose

Karina Anne Krawczyk

Bradley Leonard Beach

David Emerson Greer

James M Mrvos

Kristi Maggard Rowe

Jeffery James Buchanan

David Amos Ward

Curtis Ray Droege

Terence E Franey

Matthew Joe Russell

Ganesh Vinayak Phatak

Agnes Kam Zimmer

Paul W Graf

Michael David Lattuca

David T Shadwick

Gregory Alan Long

Timothy Lorn Howard

Ann M Piekunka

John Richard Fowler

Bart Mansdorf

Jonathan H Laurer

Edwina Floyd Lowry

Ganesh Vivayak Phatak

Kathryn E Burns

James Andrew Kerr

Jonathon Harold Laurer

John Thomas Warren

Jeanne M Saldanha

Eric Louis Killmeier

Julie A Gordon Whitney

Paige Anne Reardon Bensing

There is disclosed a removable radiation cured member suitable for use in protecting a micro-fluid ejection head. Further, a reactant mixture suitable for sealing a micro-fluid ejection head comprising a vinyl-containing oligomer, a filler, and optionally a reactive diluent and/or a photoinitiator is disclosed.

Removable radiation cured composition and process for protecting a micro-fluid ejection head

A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mmon the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

Method of making a micro-fluid ejection device

An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.

Inkjet printhead packaging tape for sealing nozzles

A liquid is applied by a bounded-region applicator such as a needle applicator over nozzle holes and over at least a continuous region close to the nozzle holes. The liquid is then cured to a solid before significant flow of the liquid into the nozzle holes. The liquid is chosen to cure to a solid which is sufficiently compliant that it deforms and leaves the nozzle holes under moderate pressure from a human hand or finger without breaking. Depending upon the material in which the nozzles are formed and the size of the nozzle holes, the liquid may be uniquely designed to incorporate resilient moieties or segments to satisfy these factors.

Liquid applied seal for inkjet orifices

Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.

Printed conductive connectors

A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.

Die attach methods and apparatus for micro-fluid ejection device

A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.

Progressive stencil printing

A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.

Multi-fluid ejection device

A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.

Method of applying an encapsulant material to an ink jet printhead

Process for manufacturing a micro-fluid ejection device

The invention provides a micro-fluid ejection head for a micro-fluid ejection device and a method for making a micro-fluid ejection head. The micro-fluid ejection head includes a semiconductor substrate containing fluid ejection devices electrically connected to contact pads on a surface thereof. A TAB circuit including lead beams is electrically connected to the contact pads on the semiconductor substrate surface. A nozzle plate structure is provided and installed relative to the TAB circuit so as to substantially cover the lead beams and contact pads in order to protect the lead beams and contact pads from exposure to fluid ejected by the micro-fluid ejection device. The micro-fluid ejection head is effective to reduce contact between electrical components and the fluid without the use of a separate encapsulant material.

Ink jet printer with extended nozzle plate and method

A low-profile ink jet cartridge assembly for an ink jet printer. The low profile ink jet cartridge assembly includes a substantially rectangular ink jet cartridge body having a printhead side, opposing side surfaces attached to the printhead side and a length, a height, and a width, wherein the length is greater than the height and the width. A printhead containing a semiconductor substrate is attached to the printhead side of the ink cartridge. A flexible circuit having a width, a length, a first edge along the length thereof, a second edge along the length thereof, first printer contact pads along at least a portion of the length thereof adjacent the first edge, and second printer contact pads along at least a portion of the length thereof adjacent the second edge is attached to the ink cartridge on the opposing side surfaces of the cartridge body.

Low profile ink jet cartridge assembly

The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

Manufacturing method for ink jet pen

An apparatus for a laser transmission welding process for attaching a synthetic filter material to a filter tower frame in an ink jet printer cartridge. The apparatus includes a laser beam source and a filter clamping fixture containing a base, slide rods attached on first ends thereof to the base, an optics support plate attached to second ends of the slide rods, a movable platform for holding an ink cartridge slidably disposed on the slide rods between the base and the optics support plate, a platform moving device for translating the platform to and from a laser welding position, a laser beam transparent plate suspended by support legs from the optics support plate to a position between the movable platform and the optics support plate. The apparatus greatly improves synthetic filter attachment to a filter tower frame in an ink cartridge.

Method and apparatus for attaching an ink jet filter to an ink cartridge

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Lexington, KY, United States of America

Paul Timothy Spivey