Agilent Technologies, Inc.

Ford Motor Company Limited

Paul Thomas Carson

Marvin Glenn Wong

Lewis R Dove

John F Casey

Paul E Stevenson

John Ralph Lindsey

Ling Liu

Albert An-Bon Yeh

John Carlson Ames

Judd Steven Carper

William John Boardman

John Crumlin

In one embodiment, a photo-imageable material is deposited on a circuit structure. The photo-imageable material is then exposed to a pattern of radiation, thereby polymerizing portions of the photo-imageable. Un-polymerized portions of the photo-imageable material are then removed to define a solder mask having solder deposition areas. Solder is then deposited in the solder deposition areas. A circuit structure that may be produced in accordance with this method is also disclosed.

Method and circuit structure employing a photo-imaged solder mask

Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) forming a plurality of channel plate layers in ceramic green sheet, 2) forming at least one channel plate feature in at least one of the channel plate layers, and 3) laminating the channel plate layers to form the channel plate. A method for making a switch with a ceramic channel plate is also disclosed.

Ceramic channel plate for a fluid-based switch, and method for making same

A method for depositing material on a channel plate such that the material is registered to one or more channels formed in the channel plate includes filling at least one of the channels with a resist that is not wetted by the material; depositing the material on at least a region of the channel plate that includes at least part of the resist, the material registering with at least one channel edge as a result of the material's abutment to the resist; and then removing the resist. The method may be used, in one embodiment, to apply an adhesive or gasket material that is used in assembling a switch.

Method for registering a deposited material with channel plate channels

An electrical relay comprising having two wettable electrical contacts supporting a conducting liquid. A non-wettable switch finger is moved between first and second positions between the electrical contacts by action of an actuator. In the first position the switch finger permits the conducting liquid to bridge the gap between the contacts and complete an electrical circuit between the contacts. In the second position the switch finger separates the conducting liquid into two volumes, breaking the electrical circuit between the contacts. The switch finger may be located at the free end of a beam that is deflected or bent by the action of piezoelectric elements.

Inserting-finger liquid metal relay

An electrical relay having two wettable electrical contacts, each supporting a conducting liquid. A wettable switch finger is moved from a non-deflected position to first and second positions by action of an actuator. In the first position the switch finger touches the conducting liquid and causes it to wet between the contacts and the switch and thereby complete an electrical circuit between the contacts. When the switch finger is in the second position, the conducting liquid cannot wet between first and second contacts and the switch finger and the electrical circuit between the first and second contacts is broken. The switch finger may be located at the free end of a beam that is deflected or bent by the action of piezoelectric elements.

Wetting finger latching piezoelectric relay

Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) forming a plurality of channel plate layers in ceramic green sheet, 2) forming at least one channel plate feature in at least one of the channel plate layers, and 3) laminating the channel plate layers to form the channel plate. Switches using ceramic channel plates, and a method for making a switch with a ceramic channel plate, are also disclosed.

Ceramic channel plate for a switch

A method for depositing material on a channel plate such that the material is registered to one or more channels formed in the channel plate includes filling at least one of the channels with a resist that is not wetted by the material; depositing the material on at least a region of the channel plate that includes at least part of the resist; and then removing the resist. The method may be used, in one embodiment, to apply an adhesive or gasket material that is used in assembling a switch.

Method for registering a deposited material with channel plate channels, and switch produced using same

An efficient way to fabricate the channels and cavities in a LIMMS device is to form them as matching upper and lower portions each created as a patterned layer of thick film dielectric material deposited on a respective upper or lower substrate. The two portions are adhered together by a patterned layer of adhesive, and hermetically sealed around an outer perimeter. The heater resistors are mounted atop the lower layer, thus suspending them away from that substrate and exposing more of their surface area. Vias can be used to route the conductors for the heaters and the switched signal contacts through the lower substrate to cooperate with surface mount techniques using solder balls on an array of contact pads. These vias can be made hermetic by their placement within the patterned layers of dielectric material and by covering their exposed ends with pads of hermetic metal. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heracus and the 4141A/D thick film compositions from DuPont.

Liquid metal micro switches using as channels and heater cavities matching patterned thick film dielectric layers on opposing thin ceramic plates

Fluid-based switches and methods for producing the same are disclosed. In one embodiment, a method for producing a switch comprises depositing a first alignment pad on a first substrate, depositing a second alignment pad on a second substrate, depositing solder on at least one of the alignment pads, depositing a switching fluid on the first substrate, and mating the first substrate to the second substrate by aligning the alignment pads and heating the solder, the substrates defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.

Fluid-based switches and methods for producing the same

A protective coating is utilized to protect the silicon during a wet chemical etch step in the process of making a micromachine, thereby preventing the formation of etched holes or pits in the micromachine. In another embodiment, silicon sacrificial pedestals are used to eliminate or greatly reduces the electrical potential difference between metal on the glass substrate and the silicon, thereby eliminating arcing and the resulting damage to silicon and metal. These pedestals may be removed after the anodic bond.

Growing community of inventors

Colorado Springs, CO, United States of America

Paul Thomas Carson