Ciba-geigy Corporation

Ciba Specialty Chemicals Corporation

Huntsman Advanced Materials Americas LLC

Huntsman Advanced Materials LLC

Paul Terrence Wombwell

Christopher H Bull

Philip D Willis

Mahesh Kotnis

Elizabeth Louise Otloski

Richard Martin Broad

William Walter Charles Badcock

Philip David Willis

Richard J Martin

Barry James Hayes

Niklaus Saner

Peter B Ludman

Marco Lucchi

William Walter Badcock

The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing microballoons.

Seamless model and method of making a seamless model

The invention relates to a seamless model free of bond lines and to a method of making same. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour. The modeling paste of the invention is a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming composition, which is preferably a polyurethane or epoxy froth-forming composition containing microballoons. The polyurethane composition exemplified herein comprises (1) an organic polyisocyanate component; (2) a polyol component comprising (a) greater than 50%, by weight of a high molecular weight polyol and (b) less than 50%, by weight, of a low molecular weight polyol; and (3) a chemical thixotropic agent in an amount sufficient to induce thixotropic properties. The epoxy composition preferably comprises (1) an epoxy resin; (2) a thixotropic agent in an amount sufficient to induce thixotropic properties; and (3) a hardener comprising (a) at least one polyethyleneimine and (b) at least one other amine having at least two amino hydrogen groups, the combined amounts of (a) and (b) being sufficient to effect cure of the epoxy resin.

Casting device and an adapter for a casting device

Curable compositions

Production of thermoset pressure gelation castings

The present invention provides a liquid epoxy resin composition that includes an epoxy resin, at least one filler and an inorganic thixotropic agent in an amount effective to reduce settling of said filler at ambient temperatures. The composition further includes a polymer powder that dissolves in and thickens the composition when the composition is heated. The polymer powder is added in an amount effective to reduce settling of said filler at temperatures up to the gelling temperature of the composition. The thixotropic agent is added in an amount that the resulting epoxy resin composition is a free-flowing liquid. The composition may optionally further include a curing agent.

Liquid epoxy resin composition

The present invention provides a process for the manufacture of a moulded article which comprises introducing a curable epoxy resin composition to a mould which is at a temperature high enough to initiate curing of the resin and supplying further resin under pressure to compensate for shrinkage of the composition, the epoxy resin containing coarse decorative particles therein, wherein the epoxy resin is introduced into the mould through a gap having a length which is 30 to 100% of that dimension of the moulded product being made which is adjacent to the gap and a width which is at least twice the maximum size of the decorative particles.

Process for molding epoxy resins with coarse decorative particles

The present invention provides a process for making a cured plastics moulding by introducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition, wherein the curable resin is an epoxy resin formulation comprising an epoxy resin containing more than one epoxide group per molecule on average, an acid anhydride hardener, an accelerator and a filler, the epoxy resin, hardener and accelerator being chosen so that the formulation is stable at 25.degree. C. for at least 14 days.

Moulding process

Growing community of inventors

Royston, United Kingdom

Paul Terrence Wombwell