Hewlett-Packard Development Company, L.p.

Hewlett-Packard Company

Paul T Artman

Eric C Peterson

Christian Laszlo Belady

Shaun Lee Harris

Stuart C Haden

Lisa Heid Pallotti

Michael C Day

William K Coxe

A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.

Processor and power supply circuit

A cooling device having a handle movably attached to a heat sink. The handle is attached to the heat sink by the use of captive fasteners. The captive fasteners serve the additional function of securing the cooling device to a heat-generating device. Springs are located between the handle and the heat sink and compress when the cooling device is attached to the heat-generating device. The springs cause a spring force to be applied between the cooling device and the heat-generating device which is maintained as the heat-generating device and the cooling device undergo thermal expansion and contraction.

Heat sink having a captive handle

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Dallas, TX, United States of America

Paul T Artman