Shin-etsu Chemical Co., Ltd.

Carnegie Mellon University

Nanogriptech, Inc.

Paul Samuel Glass

Metin Sitti

Hoyong Chung

Burak Aksak

Justin Bohn

Newell Raymond Washburn

Shree Deshpande

Elliot Geikowsky

A dry adhesive microfiber array comprising a plurality of fibers with enlarged tips, where the dry adhesive is capable of adhering to a surface of a silicon wafer and/or carrier. The dry adhesive can be debonded without the use of chemicals or heat and does not leave a residue on the surface of the wafer. In addition, a liquid can be introduced to the interface between the dry adhesive and semiconductor device to adjust the force of adhesion.

Dry adhesive for temporary bonding of semiconductor devices

The present invention is a method that (i) allows for creating micro and/or nanostructures on either planar or non-planar three-dimensional surfaces in a single molding step, and (ii) allows for the molded production of complex high-aspect ratio micro and/or nanostructures including but not limited to cylinders, conical structures, low aspect-ratio channels, bumps, or posts. An example of such a complex structure are high aspect ratio pillars with enlarged 'mushroom-shaped' or undercut tips which demonstrate enhanced, repeatable adhesion and shear strength on a variety of substrates when compared with other micro and/or nanostructures and unstructured materials. The mold of such a material requires an 'undercut' feature that cannot be produced using typical micro/nano-molding processing techniques.

Method of molding simple or complex micro and/or nanopatterned features on both planar or non-planar molded objects and surfaces and the molded objects produced using same

Present invention describes a patterned and coated micro- and nano-scale fibers elastomeric material for enhanced adhesion in wet or dry environments. A multi-step fabrication process including optical lithography, micromolding, polymer synthesis, dipping, stamping, and photopolymerization is described to produce uniform arrays of micron-scale fibers with mushroom-shaped tips coated with a thin layer of an intrinsically adhesive synthetic polymer, such as lightly crosslinked p(DMA-co-MEA).

Micro-fiber arrays with tip coating and transfer method for preparing same

Growing community of inventors

Pittsburgh, PA, United States of America

Paul Samuel Glass