3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Paul S Lugg

Catherine A Leatherdale

Andrew John Ouderkirk

Zine-Eddine Boutaghou

Joel D Oxman

Terry Lee Smith

Timothy D Fletcher

Bruce A Sventek

Matthew H Frey

Olester Benson, Jr

Kenton D Budd

Terrance P Smith

Duy K Lehuu

Vincent D Romero

Lian Soon Tan

William D Joseph

Scott G Theirl

Kejian Chen

Peter F Cullen

John E Bailey

L Charles Hardy

Blake R Dronen

Silvia L Bommarito

Jimmie R Baran

A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and a plurality of polishing elements extending from the top major surface of the polishing pad. The system further includes a polishing solution disposed between the top surface of the polishing pad and the substrate. The polishing fluid includes a fluid component, and a plurality of ceramic abrasive composites dispersed in the fluid component, the ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. The system further includes a second carrier assembly configured to receive and hold the polishing pad. The system is configured such that the polishing pad is movable relative to the substrate to carry out a polishing operation.

Polishing pads and systems for and methods of using same

A polishing solution includes a fluid component and a plurality of ceramic abrasive composites. The ceramic abrasive composites include individual abrasive particles uniformly dispersed throughout a porous ceramic matrix. At least a portion of the porous ceramic matrix includes glassy ceramic material. The ceramic abrasive composites are dispersed in the fluid component.

Composite ceramic abrasive polishing solution

A multi-layered polishing pad arrangement includes a first polishing pad layer having a first top and a first bottom major surface, a second polishing pad layer having a second top and a second bottom major surface, and a coupling arrangement disposed between the first bottom surface and the second top surface. The thickness of each of the first and second polishing pad layer ranges between 0.125 mm and 10 mm.

Multi-layered polishing pads

An abrasive article is provided. The article includes (a) a flexible backing having opposing first and second surfaces; (b) an abrasive layer comprising plurality of abrasive particles disposed on the first surface of the flexible backing; and (c) an adhesive layer comprising load bearing particles and an adhesive matrix, the adhesive layer disposed on the second surface of the polymer layer. At least a portion of the load bearing particles is substantially enveloped in the adhesive matrix and is in contact with the second surface of the polymer substrate.

Abrasive articles

An abrasive particle includes a substantially spheroid metal containing matrix having a circumference and a super abrasive material having an average diameter of less than about 8 micrometer at least partially embedded the circumference of the metal containing matrix. The abrasive particle having an average diameter of less than about 200 micrometer.

Fixed abrasive particles and articles made therefrom

Provided is an abrasive article for lapping or polishing a workpiece comprising a three-dimensional, textured, flexible, fixed abrasive construction having a first surface and a working surface, the working surface comprising a plurality of precisely shaped abrasive composites, wherein the precisely shaped abrasive composite comprises a resin phase and a metal phase, wherein the metal phase further comprises superabrasive material. Also provided are a method of polishing or lapping a workpiece and a kit comprising a three-dimensional, textured, flexible, fixed abrasive construction and instructions for carrying out the method of polishing or lapping a workpiece.

Abrasive article and method of modifying the surface of a workpiece

Light-emitting articles and methods of manufacturing such articles are disclosed. In one aspect, a light emitting article includes an optical element having an input and an output aperture, each having a size. An LED die having a size is optically coupled to the optical element. The output aperture size of the optical element matches the LED die size. In another aspect, an array of light-emitting articles includes an array of optical elements having a lapped input aperture surface, and an array of LED dies optically coupled to the optical elements at the input aperture. In another aspect, an array of light-emitting articles includes an array of optical elements, and an array of LED dies, each LED die having a size. Each LED die is optically coupled to an optical element at the input aperture. The output aperture size of the optical element is matched to the LED die size.

Arrays of light emitting articles and method of manufacturing same

Provided is a method of polishing comprising providing a workpiece, providing a fixed abrasive article, providing conditioning particles, and relatively moving the workpiece and the fixed abrasive article in the presence of the conditioning particles to modify the surface of the workpiece and to condition the fixed abrasive. The fixed abrasive article comprises a substrate having a first surface and a region of abrasive composites distributed on the first surface of the substrate. The abrasive composites include a composite binder and abrasive particles, which may be in abrasive agglomerates together with a matrix material. The abrasive particles are harder than the workpiece. The conditioning particles are sufficient to condition one or more of the composite binder, matrix material, and abrasive agglomerates. The hardness of the conditioning particles is less than the hardness of the workpiece and they do not substantially polish the workpiece.

Abrasive agglomerate polishing method

A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the shaped elements. The shaped elements may include optical elements, semiconductor elements, or both.

Process for manufacturing optical and semiconductor elements

Provided is a fixed abrasive article for polishing a workpiece having a hardness comprising (a) a substrate having a first surface and a second surface, (b) a region of abrasive composites distributed on the first surface of the substrate, and (c) a region of conditioning amalgams distributed on the first surface of the substrate. The abrasive composites include a composite binder and abrasive particles of a first hardness, which first hardness is higher than the hardness of the workpiece. The amalgams include an erodible binder and conditioning particles sufficient to condition the composite binder and having a second hardness, which second hardness is less than the hardness of the workpiece and greater than the hardness of the composite binder. Also provided are other abrasive articles, and methods of making them.

Self-contained conditioning abrasive article

An abrasive article is described. The article is suitable for the deposition and mechanical polishing of a conductive material, and comprises: a polishing layer having a textured surface comprising a binder and a second surface opposite the textured surface, the polishing layer further comprising a first channel extending therethrough; a backing having a first backing surface and a second backing surface, the first backing surface associated with the second surface of the polishing layer, the backing comprising a second channel coextensive with the first channel and extending through the backing from the first backing surface to the second backing surface; the first channel and the second channel dimensioned with respect to one another so that the textured surface of the polishing layer is outside of a line of sight.

Abrasive article for the deposition and polishing of a conductive material

A low reflectivity, variable attenuation contrast enhancement filter having a total visible light reflectance of less than about 2.0% when measured with light incident to the first outer major surface. The contrast enhancement filter has a first layer(s) for providing antireflection, the first layer(s) defining the first outer major surface; a variable attenuation element interposed between the first major outer surface and the second major outer surface; element(s) for providing fixed attenuation interposed between the variable attenuation element and the first major outer surface; and at least one substrate.

Low reflectivity contrast enhancement filter

A tape that includes an electronically conductive flexible substrate, a release layer, and an adhesive comprising an ion-intercalating material, and electrochromic devices and glazing units prepared using this tape.

Growing community of inventors

Woodbury, MN, United States of America

Paul S Lugg