Innovative Micro Technology

Optical Coating Laboratory, Inc.

Johnson and Johnson Vision Care, Inc.

Paul Rubel

John Stuart Foster

Richard Thomas Martin

Christopher S Gudeman

Jeffery Frank Summers

John Wesley Stocker

Patrick Edward Feierabend

Steven H Hovey

Kimon Rybnicek

Andrew Dexter Wallis

Gregory A Carlson

Hung P Nguyen

Bryant P Hichwa

John Harley

Stephen Robert Beaton

Bret A Coldren

Jason Tokarski

Marin Sigurdson

Michael Ferran

Michael James Shillinger

Paulo Silveira Da Motta

Jeffrey F Summers

Fardad Chamran

Alok Paranjypye

Justin Scott Jacobs

Tara Jean Rybnicek

Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.

Eight spring dual substrate MEMS plate switch and method of manufacture

A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.

Thermocompression bonding with raised feature

Systems and methods for forming an electrostatic MEMS switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. The cantilevered beam may be formed by etching the perimeter shape in the device layer of an SOI substrate. An additional void may be formed in the movable beam such that it bends about an additional hinge line as a result of the additional void. This may give the beam and switch advantageous kinematic characteristics.

Dual substrate electrostatic MEMS switch with multiple hinges and method of manufacture

A punctal plug or lacrimal insert comprising a microelectromechanical system pump and associated reservoir may be utilized to deliver precise dosages of an active agent into the eye though the tear film. The microelectromechanical system pump comprises four main components; namely, a reservoir, a pump, a series of valves and a vent. The microelectromechanical system pump is positioned within a cavity in the punctal plug. The microelectromechanical system pump is positioned with a cavity in the punctal plug.

Eye drug delivery system

A micromechanical pumping system is formed on a substrate surface. The pumping system uses a pumping element which pumps a fluid through valves which move in a plane substantially parallel to the substrate surface. An electromagnetic actuating mechanism may also be fabricated on the surface of the substrate. Magnetic flux produced by a coil around a permeable core may be coupled to a permeable member affixed to a pumping element. The permeable member and pumping element may be configured to move in a plane parallel to the substrate. The electromagnetic actuating mechanism gives the pumping system a large throw and substantial force, such that the fluid pumped by the pumping system may be pumped through a transdermal cannula to deliver a therapeutic substance to the tissue underlying the skin of a patient.

In-plane electromagnetic MEMS pump

A micromechanical electromagnetic actuator may have two separate components: a flux-generating portion and a separate movable structure. The flux-generating portion may have a plurality of conductive coils wound around a magnetically permeable material. Each coil generates a magnetic field along its axis, which is different for each of the coils. The adjacent movable structure may include magnetically permeable features, one inlaid in the movable structure and other stationary features which focus the flux produced by the flux-generating mechanism across a gap between the stationary features. By energizing each coil sequentially, a push-pull motion in the actuator may result from the force of the magnetically permeable features. This push-pull actuator may be particularly effective when used as a pumping element in a drug delivery system, or other fluidic pumping system.

Microfabicated electromagnetic actuator with push-pull motion

Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. A hermetic seal may be made around the device with a larger, secondary enclosure. Electrical access to the deformable plate may be accomplished by an electrical path which is independent of the seal. The electrical path may include a via through the first substrate or the second substrate, or a flash deposited on an external region of the switch.

Dual substrate MEMS plate switch and method of manufacture

A MEMS hysteretic thermal device may be formed having two passive beam segments driven by a current-carrying loop coupled to the surface of a substrate. The first beam segment is configured to move in a direction having a component perpendicular to the substrate surface, whereas the second beam segment is configured to move in a direction having a component parallel to the substrate surface. By providing this two-dimensional motion, a single MEMS hysteretic thermal device may by used to close a switch having at least one stationary contact affixed to the substrate surface.

Method of manufacturing a hysteretic MEMS two-dimensional thermal device

A MEMS hysteretic thermal actuator may have a plurality of beams disposed over a heating element formed on the surface of the substrate. The plurality of beams may be coupled to a passive beam which is not disposed over the heating element. One of the plurality of beams may be formed in a first plane parallel to the substrate, whereas another of the plurality of beams may be formed in a second plane closer to the surface of the substrate. When the heating element is activated, it heats the plurality of beams such that they move the passive beam in a trajectory that is neither parallel to nor perpendicular to the surface of the substrate. When the beams are cooled, they may move in a different trajectory, approaching the substrate before moving laterally across it to their initial positions. By providing one electrical contact on the distal end of the passive beam and another stationary electrical contact on the substrate surface, the MEMS hysteretic actuator may form a reliable electrical switch that is relatively simple to manufacture and operate.

Hysteretic MEMS thermal device and method of manufacture

A method for forming moveable features suspended over a substrate is described, wherein a cavity beneath the moveable feature is first formed using a liquid etchant applied through one or more release holes. After formation of the cavity, the outline of the moveable feature is formed using a dry etch process. Since the moveable feature is free to move upon its formation using the dry etch process, no stiction issues arise using the systems and methods described here.

System and method for forming moveable features on a composite substrate

A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

MEMS thermal actuator and method of manufacture

An improved MEMS thermal actuator has a cantilevered beam and a conductive circuit having two driving arms, an inner arm adjacent to the cantilevered beam, and an outer arm adjacent to the inner arm. Current flows through the inner and outer arms to heat the conductive circuit, causing it to expand relative to the cantilevered beam. A tether ties the conductive circuit to the cantilevered beam, so that upon expansion, the conductive circuit causes the cantilevered beam to deflect about its anchor point. However, only the inner arm of the driving beam is coupled to the cantilevered beam. Since the outer arm of the conductive circuit is not coupled to the cantilevered beam, the overall stiffness of the actuator may be decreased. In addition, serpentines may be placed in the outer arm of the conductive circuit, in order to further decrease the stiffness of this beam. The actuator may therefore be made more efficient, in that the deflection of the cantilevered beam may be increased for a given input current.

Singly attached MEMS thermal device and method of manufacture

A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.

Interconnect structure using through wafer vias and method of fabrication

A MEMS hysteretic thermal device may have two passive beam segments driven by a current-carrying loop coupled to the surface of a substrate. The first beam segment is configured to move in a direction having a component perpendicular to the substrate surface, whereas the second beam segment is configured to move in a direction having a component parallel to the substrate surface. By providing this two-dimensional motion, a single MEMS hysteretic thermal device may by used to close a switch having at least one stationary contact affixed to the substrate surface.

Growing community of inventors

Santa Barbara, CA, United States of America

Paul Rubel