Trikon Holdings Limited

Trikon Technologies Limited

Spts Technologies Limited

Other

Paul Rich

Stephen Robert Burgess

Clive Luca Widdicks

Amit Rastogi

Rhonda Hyndman

Scott Haymore

Anthony Paul Wilby

Knut Beekman

Claire Louise Wiggins

Eduardo Paulo Lima

Daniel Cook

Ian Moncrieff

Mark Ian Carruthers

Keith Edward Buchanan

Adrian Thomas

Nicholas Rimmer

Paul Densley

David John Thomas

A method is for depositing a dielectric material on to a substrate in a chamber by pulsed DC magnetron sputtering with a pulsed DC magnetron device which produces one or more primary magnetic fields. In the method, a sputtering material is sputtered from a target, wherein the target and the substrate are separated by a gap in the range 2.5 to 10 cm and a secondary magnetic field is produced within the chamber which causes a plasma produced by the pulsed DC magnetron device to expand towards one or more walls of the chamber.

Method and apparatus for depositing a material

An ICP plasma etching apparatus for etching a substrate includes at least one chamber, a substrate support positioned within the chamber, a plasma production device for producing a plasma for use in etching the substrate, and a protective structure which surrounds the substrate support so that, in use, a peripheral portion of the substrate is protected from unwanted deposition of material. The protective structure is arranged to be electrically biased and is formed from a metallic material so that metallic material can be sputtered from the protective structure onto an interior surface of the chamber to adhere particulate material to the interior surface.

Plasma etching apparatus

A method induces plasma vapor deposition of metal into a recess in a workpiece. The method achieves re-sputtering of the metal at the base of the recess with a sputter gas by utilizing a mixture of Ar and He and/or Ne as the sputter gas with a ratio of He and/or Ne:Ar of at least about 10:1.

Method of plasma vapour deposition

A method and apparatus for processing a thin film on a substrate. The method involves locating the substrate in a first rotational position a location opposed to a process station. The process station has a first axis and is arranged for processing the substrate about that axis. The substrate location is symmetrical about a second axis parallel to but offset from the first axis. The substrate is rotated about an axis generally orthogonal and passing through the wafer location to a second rotational position after an initial process and further processing takes place when the substrate is in the second rotational position.

Deposition methods and apparatus

This invention relates to a method of depositing a layer on an exposed surface of an insulating layer of material. The method includes treating the exposed surface with hydrogen or a gaseous source of hydrogen in the presence of a plasma, prior to or during deposition of a metallic layer.

Method of depositing a layer

Method and depositing a layer

In a sputtering apparatus for depositing material onto a workpiece, an RF coil is disposed in a chamber between a first target and a workpiece support. The RF coil includes a re-sputtering surface of electrically conductive non-target material which faces towards the workpiece support and which receives a coating of target material for re-sputtering onto the workpiece. A second target, located between the RF coil and the workpiece support, includes a sputtering surface which faces towards the RF coil and which supplies at least a portion of thc coating of target material to the re-sputtering surface of the RF coil.

Sputtering apparatus

A workpiece is processed which includes a multiplicity of recesses formed in the exposed surface. The invention includes depositing a first barrier layer of for example, titanium nitride, a second layer of aluminium alloy and a third relatively thin layer of titanium nitride and then exposing the sandwich of layers to elevated heat and pressure so that the second layer is deformed to fill the recesses

Method of processing a workpiece

Method of forming a barrier layer

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Gloucestershire, United Kingdom

Paul Rich