Texas Instruments Corporation

Other

Illumina Corporation

Kyocera Wireless Corporation

Mesa Ridge Technologies, Inc.

Paul R Smith

David Stowers

Evgeny Fomin

Aleksandr Manulis

Christopher Alan Oberhauser

Raymond Rocha

Kyle Halkola

David Kimmel

James R Catt

Eunho Noh

Scott Plunkett

Edward Hames

Brandon Burroughs

Marc Steer

Dave Hermiller

Arthur E Horton

Mark Sloan

James Beckwith

Edward Romascan

Steve Trudgen

Jordan W Brantley

James McKenrick

James Graham

Cecil W Lightfoot

Richard L Hanneman

Gary Koerper

Coordinated application processing. A method identifies processing engines available for coordinated application processing, distributes to the processing engines an application configured for execution to perform image processing, and distributes images to the processing engines. The images cover an image area that includes multiple different sub-areas, where the image processing proceeds across multiple cycles of image processing to process a respective set of images of each sub-area of the multiple different sub-areas, and where the distributing the images includes, for each sub-area of the multiple different sub-areas: selecting for that sub-area a respective processing engine of the processing engines to perform the image processing across the multiple cycles to process the respective set of images of that sub-area, and distributing, across the multiple cycles of the image processing, the images of the respective set of images of that sub-area to the respective processing engine selected for that sub-area.

Coordinated application processing

A touch sensor mounting assembly includes a carrier with a front-side surface for attaching a touch sensor circuit (such as a flex circuit board), and a back-side spring structure. The touch sensor mounting assembly can be used for mounting at least one touch sensor in a device case with at least on touch button area defined on a surface of the device case. The touch sensor mounting assembly can include a carrier including a front-side sensor-attach surface, and a back-side spring structure including at least two spring arms integral with the carrier. Touch sensor circuitry can be mounted on the front-side sensor-attach surface of the carrier, such that when, the touch sensor mounting assembly is installed in the device case adjacent the at least one touch button area, the back-side spring arms are flexed to urge the carrier with front-side mounted touch sensor circuitry toward an interior side of the touch button area of the device case. In one implementation, the devices case includes first and second adjacent touch button areas (such as up/dn), and the carrier includes a front-side sensor-attach surface dimensioned for respective first and second touch sensor circuits, and can include a back-side spring structure with dual crossed spring arms for each of the first and second touch sensor circuits.

Assembly for mounting touch sensor within device case

A modular terrain assembly generally provides cooperating modular boards. Each board has a worksurface on a base, with the base elevated on legs. A tongue along an edge of one board is received into a groove along the edge of an adjacent board, thereby enabling a unified worksurface. The tongue and groove arrangement further includes alignment members for a more precise arrangement.

Modular terrain assembly

Wireless communication device

A peripheral component interconnect (PCI) extension/expansion system wherein the PCI Local Bus can be extended from a computer system's motherboard to another location. A PCI translation card and remote PCI board communicate via a transmission medium to relay the signals from the PCI local bus to a remote location. The signals are then provided to remote expansion slots, where additional PCI components may be operated. Further, additional PCI connectors are provided for more add-in boards.

Method and apparatus for extending the signal path of a peripheral

A continuous film transistor fabrication process utilizes a roll of polyimide substrate film on which a plurality of groups of three metal contacts is patterned. The edges of the film are turned under, including portions of the metal contacts, to facilitate the ohmic bonding of the substrate contacts to other respective contacts on a support member. Holes are formed in the film between each pattern to act as indexing means for feeding the film through a series of processing stations. As the film passes through each station, a separate step in the fabrication takes place, until the completed, tested, and sorted transistors are removed from the last station.

Continuous film transistor fabrication process

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Dallas, TX, United States of America

Paul R Smith