Hoechst Celanese Corporation

Hoecht Celanese Corp.

Paul N Chen, Sr

Rohitkumar H Vora

Morton M Glick

Tai-Shung Chung

Alex S Forschirm

Michael L Jaffe

Thomas J Dolce

Vincent J Sullivan

Paul J Harget

Harris A Goldberg

O Richard Hughes

M Ishaq Haider

Vincent J Provino

William M Cooper

Gerald W McNeely

Joseph D Menczel

Lak M Walpita

Harry S Pulaski

Mike Jaffe

Victor C Astone

Kenith P Music

Michael M Jaffe

Christopher Zipp

Jeffrey S Devolve

A polymeric composition having a high dielectric constant which varies little with temperature is made from a thermoplastic polymer, a high dielectric ceramic having a dielectric constant of at least about 50 at 1.0 Ghz and 20.degree. C., and a second ceramic material having a dielectric constant of at least about 5.0 at 1.0 GHz and 20.degree. C., where the high dielectric ceramic and the second ceramic material have temperature coefficients that are opposite in sign from one another.

Polymeric compositions having a temperature-stable dielectric constant

A process for making a transparent blow molded product made of a copolyester of PET and PEN that does not thermally deform at temperatures up to 85-87 C., and the product of that process, especially a transparent blow molded bottle. The copolyester is made by transesterifying a 20/80 (w/w) PEN/PET via melt extrusion at a temperature of from about 250 C. to about 290 C. for a time sufficient to produce about 1-20% transesterification of said polymers, forming a copolymer. The copolyester is then injection molded at a temperature of from 290 C. to about 320 C. to form a transparent preform in which the copolymer has a glass transition temperature of about 85 C. or higher and a melting point temperature of at least about 225 C. The copolymer is then thermo-stretch blow molded to form a transparent product.

Transesterified pet/pen via melt extrusion

A moldable hollow glass filled PBI composition. The composition may be prepared by making a well-mixed slurry of glass microspheres in a solution of PBI in a suitable solvent, and then spinning the slurry through a jet or die under pressure and into a water bath where the particles coagulate. The solvent dissolves in the water, allowing solvent-free PBI-glass composite particles to be isolated.

Glass bubble filled polybenzimidazole

A moldable thermoset composition comprising about 5-60% liquid crystal polymer and about 95-40% of an epoxy-functional rubber by weight, a process for making and a process for using same. The composition is made by melt mixing the LCP and the epoxy-rubber to form a blend. This blend is then cooled and may be molded, extruded, or otherwise formed into a desired shape. The composition is then heat-treated to make it set.

Thermoset LCP blends

A process for making a compatible LCP blend by reactively esterifying an LCP having a carboxylic acid or ester end group with either PPO or PPS, or derivatives thereof, using a catalytic mixture containing boric acid and polyphosphoric acid or sulfuric acid. The carboxylic functionality on the LCP reacts with the hydroxyl end group on the PPO or the thiol end group on the PPS to form an ester or thioester linkage. The two polymers to be blended are melt mixed with the catalyst mixture and extruded.

Compatible LCP blends via direct esterification

A graft copolymer having a polyolefinic main chain with muconic acid groups pendant therefrom. The acid groups are bonded to the backbone of the polyolefin by free radical addition across a muconic acid double bond. Preferably, the copolymer is prepared via a reactive extrusion process. The copolymer's applications include use as a reactive compatibilizer for polymer blends. The preferred polyolefin is polypropylene.

Muconic acid grafted polyolefin compatibilizers

A miscible blend comprising from about 5 to about 95 weight percent of a polybenzimidazole and from about 95 to about 5 weight percent of a polyamide-imide having fluorine-containing linking groups, total weight percent of the two polymers being 100. A process for preparing the blends comprises dissolving in a mutual solvent from about 5 to about 95 weight percent of the aromatic polybenzimidazole to about 95 to about 5 weight percent of the polyamide-imide having fluorine-containing linking groups, based on the total weight of those polymers and subsequently evaporating the solvent, thereby producing a dried blend of a polybenzimidazole and a polyamide-imide having fluorine-containing linking groups. The blends, particularly in the form of films, fibers or fibrets, may be post-treated with heat or sulfuric acid in order to minimize their shrinkage when subsequently subjected to heat and in order to increase their resistance to solvents and acid. The polyamide-imides having fluorine-containing linking groups are prepared by forming the polycondensation product of one or more aromatic diamines, one or more trifunctional acid anhydride monomers, and one or more tetrafunctional aromatic dianhydrides, at least one of said monomers containing the group ##STR1## linking two aromatic moieties, wherein R is CF.sub.3 or phenyl.

Miscible blends of polybenzimidazoles and polyamide-imides having

The present invention provides for a novel heat stable class of polyamide-imide polymers having excellent flow properties and hydrolytic stability which are prepared by forming the polycondensation product of one or more aromatic or aliphatic diamines and a comonomer comprising a tri- or hexafluoro-substituted tricarboxylic acid anhydride (or acid derivative thereof) having the structure: ##STR1## wherein R is CF.sub.3 or a phenyl radical. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, good resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as good thermal properties, including resistance to thermooxidative degradation.

Polyamide-imide polymers having fluorine-containing linking groups

The present invention provides for hybrid polybenzimidazole and polybenzimidazolone polymers which are characterized as containing both imidazole and imidazolone structural units in the polymer chain. These polymers are characterized as containing at least one recurring monomer unit containing the structure of the formula: ##STR1## wherein Ar is a tetravalent aromatic moiety derived from an aromatic tetraamine and Ar.sub.1 is a trivalent aromatic moiety derived from a trifunctional acid, an acid anhydride or amine-reactive derivatives thereof, said polymers further characterized by an inherent viscosity of at least about 0.01 dl/g measured as a 0.5% solution in N-methyl pyrrolidone at 25.degree. C. The polymers of this invention exhibit many of the advantageous properties of both polybenzimidazole and polybenzimidazolone polymers. They are characterized as being extremely resistant to chemical attack such as by solvents, acids and bases. Their high thermal stability and excellent electrical properties (low dielectric constant) render them useful in electrical and electronic applications.

Polymers containing both imidazole and imidazolone structural units

The present invention provides for a novel heat stable class of polyamide-imide polymers having excellent flow properties and hydrolytic stability which are prepared by forming the polycondensation product of one or more aromatic or aliphatic diamines, one or more additional comonomers selected from the group consisting of a tetrafunctional aromatic dianhydride, an aromatic or aliphatic dicarboxylic acid (or acid derivative thereof) and mixtures thereof, and a comonomer comprising a tri- or hexafluoro-substituted tricarboxylic acid anhydride (or acid derivative thereof) having the structure: ##STR1## wherein Z is CF.sub.3 or a phenyl radical. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, good resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as good thermal properties, including resistance to thermooxidative degradation.

New polybenzimidazolone polymers produced from the reaction of an aromatic tetraamine with a hexafluoro dianhydride. These hexafluoro polybenzimidazolone polymers based on an aromatic hexafluoro dianhydrides show improved solubility, easy processability, low moisture uptake, high thermal stability, resistance to solvent and other improvements over conventional polybenzimidazolone polymers.

Novel hexafluoro polybenzimidazolone polymers

A compatible polymer blend containing a polyacetal, a hydroxylated polyacetal, polypropylene, and an acid-grafted polyolefine such as a muconic acid-polypropylene graft copolymer. The polyacetal is preferably a polyoxymethylene polymer such as Celcon.RTM.. The preferred hydroxylated polyacetal is one having a structure very similar to the polyacetal. The invention also includes a process for forming a compatible blend containing polypropylene and polyacetal by melt mixing polypropylene and polyacetal with an acid grafted polyolefin and hydroxylated polyacetal.

Reactive compatibilization of polyacetal and polypropylene blends

Copolyimides derived from the reaction product of 3,3'-6 F diamine or 4,4'-6 F diamine, at least one other diamine, and pyromellitic dianhydride can be rendered solvent soluble while at the same time exhibiting an improvement in both mechanical and electrical properties by the inclusion of at least one other dianhydride having a diaryl nucleus in the reaction media. Suitable such dianhydrides include bis (3,4 dicarboxy phenyl) ether dianhydride, 3,3'4,4' benzophenone tetracarboxylic dianhydride, 3,3',4,4' diphenyl tetracarboxylic acid dianhydride and 2,2 bis(3,4 dicarboxyphenyl) hexafluoropropane dianhydride (6F-DA). Such polyimides are soluble in common organic solvents such as methyl ethyl ketone or N-methyl pyrrolidone, and exhibit excellent film forming properties with improved mechanical and electrical properties as compared to the corresponding homopolyimides. They possess excellent heat stability (Tg's in excess of about 350.degree. C.) and have superior electrical properties, for example, dielectric constant of less than about 2.5 at 10 megahertz.

Copolyimides derived from 2,2-bis (amino phenyl) hexafluoropropane

A composite comprising a polyarylate or an aromatic polybenzimidazole article and a coating on at least one surface of the article comprised of a blend of from about 5 to about 95 weight percent of a polyarylate and from about 95 to about 5 weight percent of an aromatic polybenzimidazole. A process for preparing the composites comprises dissolving in a mutual solvent from about 5 to about 95 weight percent of the aromatic polybenzimidazole to about 95 to about 5 weight percent of the polyarylate, based on the total weight of those polymers, heating a polyarylate or aromatic polybenzimidazole article to a surface temperature over 100.degree. C., e.g., from about 120.degree. C., to about 180.degree. C., and then coating the polyarylate or aromatic polybenzimidazole article with the solution and subsequently evaporating the solvent, thereby producing a dried coating of a blend of a polyarylate and an aromatic polybenzimidazole on at least one surface of the article. The composites, particularly in the form of films, fibers or fibrets, may be post-treated with heat or sulfuric acid in order to minimize their shrinkage when subsequently subjected to heat and in order to increase their resistance to solvents and acid.

Composites of aromatic polybenzimidazoles and polyarylates

A novel miscible composition comprising from about 5 parts by weight to about 95 parts by weight of a polyarylate and from about 95 parts by weight to about 5 parts by weight of an aromatic polybenzimidazole. In a composition mostly comprised of an aromatic polybenzimidazole, it is preferred that the polyarylate be present in the composition in an amount sufficient to make the aromatic polybenzimidazole more thermally processable and also less susceptible to moisture. More preferably, such compositions are comprised of from about 60 parts by weight to about 95 parts by weight of an aromatic poloybenzimidazole and from about 40 parts by weight to about 5 parts by weight of a polyarylate. Most preferably, such compositions are comprised of at least about 10 parts by weight of a polyacrylate. In a composition mostly comprised of a polyarylate, it is preferred that the aromatic polybenzimidazole be present in an amount sufficient to render the polyarylate less sensitive to solvents, and to increase the thermal stability of the polyarylate. Preferably, the aromatic polybenzimidazole is present in such compositions in an amount sufficient to result in a composition with greatly enhanced solvent resistance. More preferably, such compositions are comprised of from about 60 parts by weight to about 95 parts by weight of a polyarylate and from about 40 parts by weight to about 5 parts by weight of an aromatic polybenzimidazole. Most preferably, such compositions should contain at least about 25 to about 30 parts by weight of a polybenzimidazole in order to render the polyarylate component much more resistant to solvents at room temperature. In addition to improving solvent resistance, greater amounts of aromatic polybenzimidazole in the composition substantially increase the thermal and physical properties of the composition, giving excellent price-performance characteristics. The compositions, particularly in the form of films or fibers, may be post-treated with heat or sulfuric acid in order to minimize their shrinkage when subsequently subjected to heat and in order to increase their resistance to solvents and acid.

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Gillette, NJ, United States of America

Paul N Chen, Sr