Mannkind Corporation

Olin Corporation

Enthone-omi, Inc.

Paul Menkin

Grayson Walker Stowell

Marshall L Grant

John J Freeman

Lifun Lin

Ned W Polan

Jay B Conrod

Benoit Adamo

Chad C Smutney

P Spencer Kinsey

John M Polidoro

Carl R Sahi

Andrew J Brock

Raymond J Smialek

Durand A Cercone

Van K Chiem

Disclosed herein are diketopiperazine microparticles having a specific surface area of less than about 67 m/g. The diketopiperazine microparticle can be fumaryl diketopiperazine and can comprise a drug such as insulin.

Diketopiperazine microparticles with defined specific surface areas

Disclosed herein are diketopiperazine microparticles having high capacity for adsorbing a drug or active agent. In particular, the diketopiperazine microparticle are formed using fumaryl diketopiperazine and can comprise a drug in large doses for the treatment of disease or disorders by pulmonary delivery via oral inhalation.

High capacity diketopiperazine microparticles and methods

A permanent curable photosensitive liquid dielectric polymer composition is disclosed for making copper printed circuit boards having at least one photosensitive dielectric polymer layer containing vias and circuitry thereon wherein the polymer layer has enhanced copper to dielectric adhesion. The dielectric composition preferably comprises an acrylated epoxy and a metal adhesion effective amount of amorphous silica. Printed circuit boards made using the photodefinable dielectric polymer and a method for making the printed circuit boards are also disclosed. A twice performed permanganate etching process for texturing the dielectric surface is also preferably used to further enhance the copper to dielectric adhesion.

Method for adding layers to a PWB which yields high levels of copper to

A specially controlled electrolytic process for regenerating for reuse solutions such as the post activator solution used in the direct metallization process for making printed circuit boards is disclosed whereby the contaminant tin level of the operating solution is controlled at desired levels.

Electrowinning of direct metallization accelerators

An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.

Surface topography optimization through control of chloride

Growing community of inventors

Branford, CT, United States of America

Paul Menkin