University College Cork

Intel Corporation

Apple Inc.

Paul McCloskey

Terence O'Donnell

Sean Cian O'Mathuna

Zoran Pavlovic

Donald S Gardner

Shawn Searles

Joseph T DiBene, Ii

Yizhang Yang

David P Cappabianca

Le Wang

Saibal Roy

Andrew Mark Connell

Stephen O'Reilly

William Lawton

Brice Jamieson

Graeme Maxwell

Joseph O'Brien

Hugh Charles Smiddy

Cian O'Mathuna

Magall Brunet

Daniel Smallwood

Hugh Smiddy

Seamus O'Driscoll

Santosh Kulkarni

Cian O'MATHUNA

The present invention provides an inductor device comprising one or more interconnected columns of conductive material embedded in a supporting structure, wherein the one or more columns comprise an input terminal and an output terminal; and wherein each column is surrounded by a first magnetic layer.

Vertical magnetic structure for integrated power conversion

An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.

Coupled inductor structures utilizing magnetic films

Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a magnetic material on a substrate, wherein the magnetic material comprises rhenium, cobalt, iron and phosphorus, and annealing the magnetic material at a temperature below about 330 degrees Celsius, wherein the coercivity of the annealed magnetic material is below about 1 Oersted.

Forming electroplated inductor structures for integrated circuits

An insulating layer () and a conductive seed layer () are applied to a substrate () in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer () is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.

Plating of multi-layer structures

Growing community of inventors

Cork, Ireland

Paul McCloskey