Kyocera Wireless Corporation

Kyocera Corporation

Paul Martinez

Scott David Beith

A system and method for making a band selection in a wireless communications device is provided. The available bands include a first-communication band, a second communication band, and an auxiliary band. A wideband diplexer provides a wideband path, which includes the first-communication band and the auxiliary band, and a second-communication band path. A combination duplexer couples to the wideband path, and has an auxiliary signal port, a first-band receive port, and a first-band transmit port. A standard duplexer couples to the second communication path to provide a second-band receive port and a second-band transmit port. In one example, the first communication band is the PCS band, the second communication band is the cellular band, and the auxiliary signal is a GPS satellite signal.

System and method for selecting a communication band

A telephone monitors ambient noise, and alters the characteristics of the audible ring to distinguish the sound of the ringing telephone from the ambient noise. Such characteristics include the decibel level, the sound frequency, and the rhythmic pattern or the ringing sound.

Smart ringer

A system and method for reducing an apparent height of a board system are provided. The board system may include, for example, a carrier, a component, a printed circuit board and/or a solder material. The component is mounted on a first side of the carrier. The printed circuit board has a hole that is structured to accommodate the component. The solder material solders the carrier to the printed circuit board and provides a structural bond between the carrier and the printed circuit board. At least one portion of the solder material provides an electrical coupling between the carrier and the printed circuit board and at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.

System and method for reducing apparent height of a board system

A system for reducing an apparent height of a board system is provided. The board system may include, for example, a carrier, a component, a printed circuit board and/or a solder material. The component is mounted on a first side of the carrier. The printed circuit board has a hole that is structured to accommodate the component. The solder material solders the carrier to the printed circuit board and provides a structural bond between the carrier and the printed circuit board. At least one portion of the solder material provides an electrical coupling between the carrier and the printed circuit board and at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.

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San Diego, CA, United States of America

Paul Martinez