Motorola Corporation

Paul L Sullivan

David James Dougherty

John W Hart, Jr

Robert W Kamb

Richard E Heppler

A package assembly (70) for encapsulating and vertically surface mounting a semiconductor device such as an accelerometer includes a semiconductor device (40), a package (44) enclosing the semiconductor device, and a plurality of leads (16, 18) protruding from the package. The plurality of leads are formed from a common leadframe (10) and an internal portion of a first lead of the plurality of leads is offset from a common plane corresponding to the common leadframe prior to forming any of the plurality of leads. The offset lead increases the rigidity and vibration-resistance of the package assembly.

Package assembly for an electronic component

A semiconductor device (10) is formed from a single leadframe (11) by aligning two electronic components (22,24) relative to each other. The leadframe (11) has two bonding regions (30,31), which are offset from each other, and interconnect bars (13) which are used to align the two bonding regions (30,31). After the electronic components (22,24) are mounted to their respective bonding regions (30,31), the interconnect bars (13) are bent downward or upward relative to the plane formed by the leadframe (11). The bending of the interconnect bars (13) will move the two electronic components (22,24) towards each other in the direction essentially parallel to the plane of the leadframe (11). A transparent mold (28) is then formed to encapsulate the electronic components (22,24). A body (29) is then formed around the transparent mold (28) and leads (19,20). A trim and form operation releases the semiconductor device (10) from the leadframe (11).

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Phoenix, AZ, United States of America

Paul L Sullivan