M&t Chemicals, Inc.

Atochem North America, Inc.

Elf Atochem North America, Inc.

Paul L Hung

Kenneth K Tseng

Mark L Lavach

Richard J Radigan

David S Rosen

William L Smith

John Cioffi

Daniel B Dess

Sriram Seshadri

An improvement in the preparation of printed circuits comprises inserting a deformable layer between the phototool or support layer, and the solder mask. The deformable layer provides a uniform, integral and relatively thin coating of solder mask over circuit components, and results in higher-quality solder joints and lower rejection rates for finished boards.

Printed-wireboard photoimaging

The present invention comprises a stabilized halogen containing polymer, preferably poly(vinyl halide), and more preferably poly(vinyl chloride) composition. A preferred polymer composition is a rigid halogenated polymer such as rigid poly(vinyl chloride). The composition contains at least one metal salt selected from the group consisting of at least one carboxylic acid or derivative thereof having at least two carboxyl groups, at least one carboxyl group and at least one hydroxyl group, at least one carboxyl group and at least one mercaptan, and an aromatic carboxylic acid having at least one carboxyl group. The metal salt is most preferably disodium adipate.

Stabilized halogen containing polymer compositions

A UV curable, aqueous alkaline developable solder mask composition having tenting capabilities includes a thermal free radical initiator capable of generating free radicals with heat, and a polyunsaturated compound capable of being thermally cross-linked by the free radicals to provide a substantially fully cured solder mask coating.

UV curable compositions for making tentable solder mask coating

Aqueous alkaline developable, UV curable urethane acrylate compounds and compositions are particularly useful for making flexible, 100% solids, solvent-free solder mask coatings which are characterized by having screen-printable viscosities, rapid developability and advantageous performance characteristics.

Aqueous akaline developable, UV curable urethane acrylate compounds and

A composition including a mixture of UV curable urethane acrylate and a urethane diacrylate compounds provides an aqueous alkaline developable, flexible solder mask having excellent electrical insulation resistance under hydrolytic testing conditions at elevated temperatures.

UV curable compositions for making improved solder mask coatings

An aqueous alkaline developable UV curable urethane acrylate compound and composition are used for making flexible solder mask coatings, characterized by rapid development in an aqueous, alkaline medium, and advantageous performance properties.

Aqueous alkaline developable, UV curable urethane acrylate compounds and

A printed circuit board having improved adhesion between solder mask and metal includes a primer film on the metal deposited from an aqueous solution which includes 0.01 to 10% by weight of a carboxyl-containing polymer or copolymer.

Printed circuit boards having improved adhesion between solder mask and

A method and composition for increasing the cure depth of a solder mask coating at a low UV energy level. The stable composition, which includes a UV curable compound and a photoinitiator, is characterized by the presence of triphenylphosphite in the composition.

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Edison, NJ, United States of America

Paul L Hung