Lexmark International, Inc.

Other

Brooks Automation Gmbh

Paul Kevin Hall

Keith Bryan Hardin

John Thomas Fessler

Robert Aaron Oglesbee

Qing Zhang

Zachary Charles Nathan Kratzer

Brian Lee Nally

Kevin P Flynn

Robert Allan Menke

Mikhail Boiarski

Oleg Podtcherniaev

Tamirisa V V R Apparao

Richard Herman Dressman

Brian Lee Naily

Brandon Robert Shields

Roger Lachenbruch

Robert Lee Oglesbee

A Z-directed capacitor according to one embodiment includes a body having top, bottom and side surfaces, a cross-sectional shape that is insertable into a mounting hole in a printed circuit board, and a plurality of stacked support members. Each support member includes an annular plate mounted on a surface thereof. A first conductive side channel and a second conductive side channel are formed in the side surface and extend along a top-to-bottom dimension of the body. A first set of the annular plates electrically contact the first conductive side channel but not the second conductive side channel and a second set of the annular plates electrically contact the second conductive side channel but not the first conductive side channel. A third conductive side channel is formed in the side surface, extends along the top-to-bottom dimension of the body and is electrically separated from the annular plates.

Z-directed capacitor components for printed circuit boards

A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

Methods for manufacturing a Z-directed printed circuit board component having a removable end portion

A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.

Screening process for manufacturing a Z-directed component for a printed circuit board

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes forming the Z-directed component in a cavity formed by a constraining material that defines the outer shape of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material

A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Z-directed delay line components for printed circuit boards

A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Z-directed pass-through components for printed circuit boards

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.

Die press process for manufacturing a Z-directed component for a printed circuit board

A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes depositing a liquid based material onto a top surface of a rotatable plate. The top surface of the rotatable plate has at least one cavity formed thereon that defines the shape of a layer of the z-directed component. The rotatable plate is spun to level a top surface of the liquid based material in the at least one cavity. The liquid based material is cured to form the layer of the z-directed component. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed including a stack of component layers that includes the formed layer.

Spin coat process for manufacturing a Z-directed component for a printed circuit board

A Z-directed connector component for insertion into a printed circuit board and providing electrical connections to internal conductive planes contained with the PCB and/or to external conductive traces on the surface of the PCB. In one embodiment the Z-directed component is housed within the thickness of the PCB allowing other components to be mounted over it. The body of the Z-directed connector component may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Z-directed connector components for printed circuit boards

A Z-directed filter component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed filter component is mounted within the thickness of the PCB allowing other components to be mounted over it. The filter may be T-filter or a Pi-filter within the body of the Z-directed component. The body may also contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Z-directed filter components for printed circuit boards

A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

For EMI reduction the current modulation profile is preferably used for frequencies over 1 GHz while the frequency deviation is increased at least to &#xb1;2.5 MHz and the modulation frequency is increased to at least 150 kHz, preferably about 260 kHz. In an alternative embodiment, the modification frequency is 1 MHz or greater so that a segmented spectrum is achieved. For clocks having basic frequency below 1 GHz, but having strong harmonics higher than 1 GHz, modulation of the foregoing is combined with the slower modulation currently used. EMI reduction is realized both at the lower and the higher harmonics.

High frequency spread spectrum clock generation

A digital apparatus having a cable comprising a plurality of high-speed and low-speed signal carrying conductors, the conductors carrying the low-speed signals are bypassed to a signal ground with selected values of capacitance so as to become virtual signal ground return conductors for the high-speed signal conductors. The selected values of capacitance have a lower impedance then the characteristic impedance of the conductors in the cable. The cable may be a multi conductor cable, a ribbon cable, a flex cable, a twisted pair cable, etc. In a similar fashion, signal conductors on a printed circuit board, not having a separate ground plane layer, may create virtual signal ground returns from the low-speed signal carrying conductors that are proximate to the high-speed signal carrying conductors for reduction of radiated electromagnetic radio frequency interference.

Growing community of inventors

Lexington, KY, United States of America

Paul Kevin Hall