Pac Tech - Packaging Technologies Gmbh

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Pac Tec - Packaging Technologies Gmbh

Other

Paul Kasulke

Elke Zakel

Ghassem Azdasht

Rolf Aschenbrenner

Lars Titerle

Oliver Uebel

Hans-Hermann Oppermann

Andreas Ostmann

Frank Ansorge

Lothar Dietrich

Stefan Weiss

J&uuml;rgen Schredl

Habib Badrihafifekr

In a basic variant of a soldering device whereby a laser device is used for melting solder material (), a protective device is provided which protects the laser lens system () from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel () into an outlet channel () and/or by a diaphragm () arranged in front of the laser lens system.

Device for removing solder material from a soldered joint

In order to apply solder material () to a workpiece (), compressed gas is guided through a bore hole () of a capillary (). A pressure sensor () situated in the bore hole () measures the dynamic pressure of the compressed gas. As soon as the tip () of the capillary approaches the workpiece (), the dynamic pressure increases and is used as a measure for the distance between the tip () of the capillary () and the workpiece (), enabling the feed motion of the capillary to be controlled.

Method and device for applying material to a workpiece

Process for the formation of a spatial chip arrangement having several chips () arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces () to assigned conducting paths () of a conducting-path structure () arranged on at least one carrier substrate () by the chips being arranged transverse to the longitudinal extent of the carrier substrate.

Process for the formation of a spatial chip arrangement and spatial chip arrangement

The invention relates to a device for applying pieces of material to a workpiece. Said device comprises a plurality of capillaries which respectively bring a piece of material () to a work station () in one working cycle. The piece of material is placed on the work station. A filling station fills a circular conveyer with a number of pieces of material () corresponding to the number of capillaries (). An extracting station () is arranged in the transport path from the filling station () to the machining station ('), said extracting station () extracting individual fragments of material () in a selective manner.

Method and device for applying pieces of material to a workpiece

The device for positioning a tool () in relation to a workpiece () controls drives () in relation to three spatial axes (x, y, z) through two cameras (), the first () of which takes an image essentially along a spatial axis (y), the other () being oriented essentially vertically with respect to a surface () of the workpiece.

Device for positioning a tool in relation to a workpiece

The present invention relates to a method of producing a contactless chip card. In a first step of the method, a card body with one or a plurality of recesses on one card body side is produced from a theremoplastic material, preferably by injection moulding. Bumps being formed on the base surface of the recesses. Subsequently, conductor tracks corresponding to a coil as a conductor track pattern are impressed directly onto surface areas of the card body side including the recesses using a hot impressing technique. The conductor tracks are impressed especially also onto surface areas inside the recesses such that same extends across the bumps. One or a plurality of chips are then aligned in the recesses and contacted with the conductor tracks in the recesses which extend across the bumps. The method according to the present invention is advantageous insofar as it permits a simple production of a chip card, which requires only a few method steps and is therefore also economical. Furthermore, such a chip card is both mechanically stable and reliable, since it comprises very few individual layers and since the conductor tracks of the coil are applied directly to the card body.

Method for producing contactless chip cards and corresponding contactless chip card

Process for the selective formation of contact metallisations on terminal areas of a substrate, wherein the surface of the substrate is covered with a template in such a way that template openings forming deposit spaces are arranged above the terminal areas, and wherein the deposit spaces are filled with a solder material, and fusing of the solder material is effected with a view to forming the contact metallisations in the deposit spaces which are non-wettable at least in regions of contact with the solder material.

Process for selective soldering

Process for the formation of a spatial chip arrangement having several chips (,) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (,) to assigned conducting paths (,) of a conducting-path structure (,) arranged on at least one carrier substrate (,) by the chips being arranged either transverse to the longitudinal extent of the carrier substrate or parallel to the longitudinal extent of the flexibly constructed carrier substrate, as well as a spatial chip arrangement that is formed by means of this process.

Chips arranged in plurality of planes and electrically connected to one another

Method and apparatus for the testing of substrates which are provided with a wiring structure, in particular, chips (,), in conjunction with which, by means of a solder-deposit carrier (,) which is provided with a structured, electrically conductive coating (,) with bond pads (,) for the arranging of solder deposits (,) and their transfer to correspondingly arranged bond pads (,) of a substrate (,), an electrical check of the wiring structure of the substrate (,) takes place during the transfer of the solder deposits (,).

Method and apparatus for testing chips

Method and device for repairing defective soldered joints

Chip module (20) with a chip carrier (21) and at least one chip (22), wherein the chip carrier is designed as a sheet with a carrier layer (23) of plastics material and a conductor path structure (24) with conductor paths (28), and the chip carrier is connected to the chip with interposition of a filling material (37), wherein the conductor paths are connected on their front to attachment faces (32) of the chip and, on their rear side (27), have external bonding regions (26) for forming a flatly distributed attachment face arrangement (34) for the connection of the chip module to an electronic component or a substrate (31), and the conductor paths (28) extend in a plane on the chip bonding side (35) of the carrier layer (23) facing the chip (22), the external bonding regions (26) are formed by recesses in the carrier layer (23) which extend toward the rear side (27) of the conductor paths (28) and the carrier layer (23) extends over the region of the attachment faces (30) of the chip.

Chip module with conductor paths on the chip bonding side of a chip

A method of attaching an electronic component to a surface of a plate-shaped support member has as a first step the step of applying the electronic component to the surface of the support member, a solder being arranged between the electronic component and the support member. Following this, a glass fiber or a glass fiber bundle is applied to the surface of the plate-shaped support member located opposite the electronic component. Finally, a laser pulse is conducted through the glass fiber or glass fiber bundle for melting the solder so as to establish a punctiform electrical and mechanical connection between the support member and the electronic component in this way.

Method of attaching a component to a plate-shaped support

A connecting structure (23) for establishing a thermal connection between at lest two components (21, 22) composed of materials with different expansion coefficients, wherein at least one component forms an electronic power element (21) and higher-melting-point materials are used for the contacting, which higher-melting-point materials form isolated connecting elements (29) between the contact surfaces (27, 28) of the components (21, 22).

Thermal connecting structure for connecting materials with different

Method for the preparation of electrodeposited or galvanically deposited bumps for the bonding of integrated circuits, characterized by two subsequent metal depositions, deposited without an external current source (chemical metal deposition) on a metallization 1, the first deposition being thicker than the second and the second deposition being more even or more regular throughout a large area than the first one.

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Berlin, Germany

Paul Kasulke