Corning Incorporated

Paul Jeffrey Williamson

Robert Sabia

Michael John Moore

Jeffery Scott Stone

Charles Michael Darcangelo

Chunhe Zhang

Harrie J Stevens

Jonas Bankaitis

Methods and apparatus for processing edge portions of a donor semiconductor wafer include controlling chemical mechanical polishing parameters to achieve chamfering of the edges of the donor semiconductor wafer; and alternatively or additionally flexing the donor semiconductor wafer to present a concave configuration, where edge portions thereof are pronounced as compared to a central surface area thereof, such that the pronounced edge portions of the donor semiconductor wafer are preferentially polished against a polishing surface in order to achieve the chamfering.

Methods and apparatus for edge chamfering of semiconductor wafers using chemical mechanical polishing

The invention provides a means for making below 200 nm VUV optical microlithography lens elements and preforms therefor. The inventive methods include polishing a fluoride optical lithography crystal with cerium to a surface roughness less than five angstroms. The invention includes making a 157 nm VUV optical lithography element preform by polishing a calcium fluoride crystal with cerium oxide polish.

Angstrom polishing of calcium fluoride optical VUV microlithography lens elements and preforms

Growing community of inventors

Corning, NY, United States of America

Paul Jeffrey Williamson