Raychem Limited

Other

Paul James Gibney

Nicholas J Smith

Michael J Ludden

Peter Nyholm

Polymer (preferably polyimide) sheets with laser ablated through-holes plated with metal are used for making electrical connections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting-point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4-4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phenylenediamine, preferably p-phenylenediamine).

Uses of uniaxially electrically conductive articles

The present concepts include '1:1' uniax (40) with one conductive through-hole per chip connection site, 'mirror chip' testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subject to preferred materials (UPILEX polyimide) and techniques (U.V. laser ablation, minimum taper of holes).

Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical conections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4,4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phylenediamine, preferably p-phenylenediamine).

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Swindon, United Kingdom

Paul James Gibney