Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Dow Global Technolgoies LLC

Paul J Sacchetti

Samuel J November

Andrew M Geiger

Paul Libbers

Jonathan Tracy

David Verbaro

Michael E Watkins

John Esbenshade

Abraham D Schuitman

James R Ogle

Nestor A Vasquez

Blake R Stalder

A method including providing a ceramic log () with a first end and an opposing second end; providing one or more cutting devices () comprised of a dual bladed cutting member (); and removing material by cutting at least the first end with the dual bladed cutting member (), wherein a first blade () of the dual bladed cutting member () provides a finished surface and a second blade () removes a percentage of scrap above the finished surface. An apparatus () for cutting a ceramic log ().

Method and apparatus for preparing ceramic body segments

A mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers is provided, wherein inclusions of entrained gas inclusion defects are minimized.

Mix head assembly for forming chemical mechanical polishing pads

A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized.

Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects

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Warrington, PA, United States of America

Paul J Sacchetti