Cts Corporation

Paul J Kaverman

Ronald J Dedert

William A Hollinger, Jr

An IC package design and method of making the package design that provides anti-bridging between metal leads. The anti-bridge IC package design extends bottom covercoat material out onto the leads a sufficient distance to prevent solder bridging that typically takes place in cup regions of gull wing shaped leads. A further feature of the invention is to provide a method of applying covercoat material to the IC and the leads in the same process step. A resilient material wheel and related manufacturing equipment is used to apply a single covercoat material, like epoxy, in a single step that serves as both the bottom covercoat and lead anti-bridge coat for the IC.

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Geneva, IN, United States of America

Paul J Kaverman