Intel Corporation

Sanyo Denki Co., Ltd.

Intel Corproation

Tahoe Research, Ltd.

Paul J Gwin

Mark E Sprenger

Brian J Long

Rolf A Konstad

Peter A Davison

Joshua Boelter

Geoff Y Schreiber

Aleksander Magi

Mark Angus MacDonald

Russell S Aoki

Ralph V Miele

David Pidwerbecki

Shawn McEuen

Kenan Huseyin Arik

Aaron P Anderson

Christian Amoah-Kusi

William S Bollengier

Gregory Martin Chrysler

Hong W Wong

Tomer Rider

James M Okuley

Ioan Sauciuc

Je-Young Chang

John Hung

James D Williams

Ravi S Prasher

Nathaniel David Naegle

Mohamed A Abdelmoneum

Ramon C Cancel Olmo

Andy Keates

Duncan Glendinning

Ayeshwarya B Mahajan

Dor Levy

Tomoaki Ikeda

Harish Jagadish

David Chau

Masashi Miyazawa

Masayuki Iijima

Mark A Trautman

John K Grooms

Prasad Alluri

Rashed Mahameed

Kai-Uwe Schmidt

Choong-Un Kim

Ra'anan Sover

Madhukar Patil

Alexey Chinkov

Brian A Scott

Kouji Ueno

Jorge Ulises Martinez Araiza

Balu Pathangey

Paul C George

Nan Allison Yao

Narasimha Shastri

Mark E Luke

Linh M Le

Andrew Morning-Smith

Nathaniel D Naegle

Rolf Konstad

An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.

Triangular board assembly for solid state drive

An apparatus is described. The apparatus includes a controller to cause a volume of an ambient of a two phase immersion cooling system to be modulated. The ambient is to include a condenser that is to emit fluid warmed by vapor in the ambient. The vapor is to be generated by heat. The heat is to be generated by electronic devices that are to be immersed in a liquid bath. The controller is to cause the volume to increase in response to a first temperature of the fluid approaching a first lower limit. The controller is to cause the volume to decrease in response to a second temperature of the fluid approaching a second higher limit.

Two phase immersion cooling system with useable warmed liquid output

There may be provided a wafer support member which may include a support column and a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column. Each wafer-engagement-shelf may define a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf. The plurality of through-holes may serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports.

Wafer support member and method of manufacturing a wafer support member

Example blood pressure apparatus using active materials and related methods are described herein. An example apparatus includes a band to be worn around a limb of a user, an active material carried by the band and a controller to: (1) apply an activation signal to the active material to constrict blood flow in the limb, and (2) reduce the activation signal to allow blood flow in the limb.

Blood pressure apparatus using active materials and related methods

Particular embodiments described herein provide for an electronic device that can be configured to receive a plurality of thermal parameters for a device, identify one or more of the plurality of thermal parameters that affect a thermal response of the device, and create a thermal vector for the device using the one or more of the plurality of thermal parameters that affect the thermal response of the device, where the thermal vector can be used to predict a new thermal response of the device. In an example, the thermal vector includes weighted thermal parameters.

Disposition of a workload based on a thermal response of a device

Examples may include techniques for use of a latch to secure a device inserted in a host computing system. The latch including a housing having holes or ports and an active contacts pad to receive external communication or control links routed through the holes or ports and to further route the communication or control links to circuitry at the device. The latch also including a securing pin attached to a lever to secure the device to the host computing system when the lever is engaged.

Techniques for use of a multipurpose latch

An apparatus is described. The apparatus includes a solid state drive (SSD) controller that includes logic circuitry to perform an event based hottest non volatile memory die identification process in which one or more different hottest non volatile memory die within the SSD are able to be identified over an operational time period of the SSD in response to different respective events that arise during the operational time period.

SSD temperature control technique

A heatsink includes a fin-set that includes a corrugated ribbon having a first, deformable, portion and a second, convective, portion that is not deformed. A plurality of corrugated ribbons may be physically and/or thermally coupled (e.g., via mechanical fasteners, thermally conductive bonding, or reflow) to form the heatsink. A force may be applied to the heatsink sufficient to at least partially crush the first, deformable, portion to conform to an external surface of an electronic device. The heatsink may be physically affixed and thermally coupled to an external surface of the electronic device via mechanical fasteners, thermally conductive adhesives or via reflow of a low-melt temperature layer disposed on an external surface of the heatsink. The crushed portion of the first, deformable, portion conforms to the regular (e.g., planar) or irregular surface profile of the electronic device, beneficially and surprisingly improving thermal performance of the heatsink.

Crushable heat sink for electronic devices

Apparatuses, methods, and systems are described herein for a thermal distribution manager to allocate multiple data portions of a data object to be written into a plurality of memory devices, as well as to restore the data object. The thermal distribution manager also reads some of the allocated multiple data portions from the respective memory devices. The allocation may include division of the data object and is based at least in part on respective temperatures of the memory devices prior to a write time and the reading and restoration is based at least in part on respective temperatures of the memory devices prior to a read time. The thermal distribution manager may allocate the multiple data portions according to a frequency of access of a first data portion relative to a frequency of access of a second data portion. Additional embodiments may be described and claimed.

Data portion allocation for temperature management of memory devices

Methods and apparatus to grasp an object with an unmanned aerial vehicle are described herein. An example unmanned aerial vehicle includes a gripper having a claw to grasp onto an object and an active material disposed on the claw. The example unmanned aerial vehicle further includes a material activator to: (1) apply an activation signal to the active material to soften the active material while the claw grasps the object with the active material, and (2) allow the active material to harden in a shape substantially matching a surface of the object.

Methods and apparatus to grasp an object with an unmanned aerial vehicle

Particular embodiments described herein provide for an electronic device, that includes a display and a bounce reduction mechanism configured to provide an active counterforce to a force on the display. In an example, a proximity sensor can detect when a device is going to create the force on the display. In another example, a screen bounce detection engine to detect oscillations of the display and the bounce reduction mechanism is configured to provide an active counterforce to dampen oscillation of the display.

Reduction of touchscreen bounce

In an embodiment, a system includes a processor with at least one core to execute an application to provide intrusion detection and protection, a radar sensor to detect presence of one or more persons within a detection zone about the system and to output a detection notification responsive to the presence detection, and a peripheral controller coupled to the radar sensor to receive the detection notification and to provide the detection notification to the application, where the application is to cause a protection measure to be performed responsive to the detection notification. Other embodiments are described and claimed.

Providing intrusion detection, monitoring and protection in a system

A first threshold temperature is maintained for operating a solid state drive (SSD) in a first mode. A second threshold temperature is maintained for operating the SSD in a second mode in which read and write operations are performed at a higher rate than in the first mode, wherein the second threshold temperature is higher than the first threshold temperature. The SSD is switched from the first mode to the second mode, in response to an operating temperature of the SSD exceeding the first threshold temperature.

Temperature dependent modes of operation of a semiconductor memory device

Techniques related to a method, apparatus, and system for flexible displays are described herein. For example, an apparatus may include a flexible display and an electroactive layer. Shape changes in the electroactive layer generate shape changes in the flexible display. The shape changes include one or more coil turns configured to coil the flexible display.

Electroactive layer to coil a flexible display

Growing community of inventors

Orangevale, CA, United States of America

Paul J Gwin