Digital Equipment Corporation

Paul J Graffam

Jeffrey A Metzger

A system and method for interconnecting electronic components on a circuit board that minimize etch lines, minimize stub lengths, reduce the number of vias that are needed, and densely pack electronic components on the circuit board. According to system and method, electronic components are attached to the top planar surface of the circuit board such that adjacent components are rotated 180.degree. in the plane of the top planar surface. These adjacent electronic components also are offset from one another. The electronic components that are attached to the bottom planar surface of the circuit board also have adjacent electronic components rotated 180.degree. in the plane of the bottom planar surface, and are offset. The arrangement of the components disposed at the bottom planar surface is a mirror image of the components disposed at the top planar surface.

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Leominster, MA, United States of America

Paul J Graffam