At&t Bell Laboratories

Paul J Englert

Michael A Oien

Peter Hartpence Read

Circuit packs to be tested are loaded into first and second test chambers commonly served by a hot liquid reservoir and by a cold liquid reservoir of which both are coupled to both chambers by a liquid handling system containing valves controlled by program determined signals from a controller unit to direct liquid flows as desired between the chambers and reservoirs. During liquid contact periods for the chambers, liquid from the hot reservoir is intermittently pumped into each of the chambers at times different for the two chambers, and liquid from the cold reservoir is intermittently pumped into each of the chambers at times which are different for the two chambers and intervening at each chamber the times of hot liquid pumping thereto, whereby the packs in each chamber are alternately heated and chilled by such liquid so as to be thermally stressed, and the responses of the packs to such stressing are detected. After completion of the liquid contact periods, an air handling system common to both chambers is used to dry the chambers and the packs therein, to reclaim liquid absorbed as vapor in the air during such drying and to cool the dried articles to a comfortable temperature for unloading from the chambers.

Liquid thermal cycling methods and apparatus

Disclosed is a method for cleaning solder flux connectors. A first solution comprising a monobasic ester is applied to the connectors. A second solution, which can include a solvent for a lubricant, is then applied to displace the first solvent.

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Morristown, NJ, United States of America

Paul J Englert