Micron Technology Incorporated

Paul J Clawson

Warren M Farnworth

Tom A Muntifering

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces

Some embodiments include methods in which a front side region of a semiconductor substrate is placed against a surface. While the front side region is against the surface, the semiconductor substrate is thinned, and then cut into a plurality of dice. The surface may be a pliable material, and may be stretched after the cutting to increase separation between at least some of the dice. While the pliable surface is stretched, at least some of the dice may be picked from the surface. In some embodiments, the semiconductor substrate is retained to the surface with a radiation-curable material. The material is in an uncured and tacky form during the thinning of the substrate, and is subsequently cured into a less tacky form prior to the picking of dice from the surface.

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Boise, ID, United States of America

Paul J Clawson