Shipley Company LLC

Rohm & Haas Electronic Materials LLC

Paul J Ciccolo

James E Rychwalski

Edward C Couble

Philip D Knudsen

Brian D Amos

Stephen McCammon

Robert B Currie

Polymerized negative acting photoresists are removed from substrates at relatively low temperatures and fast stripping times using aqueous based alkaline solutions.

Method of removing negative acting photoresists

A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.

Conditioning process for electroless plating of polyetherimides

A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.

Pretreatment process for electroless plating of polyimides

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Ashland, MA, United States of America

Paul J Ciccolo