The Charles Stark Draper Laboratory, Inc.

Mtpv Power Corporation

Other

Massachusetts Institute of Technology

Mtpv, LLC

Milli Sensors Systems & Actuators, Inc.

Paul Greiff

Eric L Brown

Burton Boxenhorn

Robert S DiMatteo

Christopher W Leitz

Jose M Borrego

Donato Cardarelli

Andrew C Walsh

Marc Steven Weinberg

Jonathan Jay Bernstein

Kaplesh Kumar

Charles R Dauwalter

Joseph G Walsh

Anthony M Moscaritolo

Ralph Hopkins

Brock S Dew

Bruno A Nardelli

Bernard M Antkowiak

Jerome B Sohn

Brian N Hubert

Bin Zhang

Lyle J Jenkins

Robert Dimatteo

Shannon J Kovar

Timothy R Schuyler

Trace W Cody

Mark D Fontanella

Richard M Walker

David Mather

Jose M Borrega

Edmund R Foster

Richard H Coco

Christopher W Melanson

Paul Brezinski

Jose Borrego

Andrew Walsh

A thermophotovoltaic panel assembly including a heat sink and a plurality of thermophotovoltaic modules mounted on the heat sink. Each thermophotovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The thermophotovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the thermophotovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.

Radiative micron-gap thermophotovoltaic system with transparent emitter

The present invention relates to multi-cell devices fabricated on a common substrate that are more desirable than single cell devices, particularly in photovoltaic applications. Multi-cell devices operate with lower currents, higher output voltages, and lower internal power losses. Prior art multi-cell devices use physical isolation to achieve electrical isolation between cells. In order to fabricate a multicell device on a common substrate, the individual cells must be electrically isolated from one another. In the prior art, isolation generally required creating a physical dielectric barrier between the cells, which adds complexity and cost to the fabrication process. The disclosed invention achieves electrical isolation without physical isolation by proper orientation of interdigitated junctions such that the diffusion fields present in the interdigitated region essentially prevent the formation of a significant parasitic current which would be in opposition to the output of the device.

Method and structure for multi-cell devices without physical isolation

The present technology relates to multi-cell devices fabricated on a common substrate that are more desirable than single cell devices, particularly in photovoltaic applications. Multi-cell devices operate with lower currents, higher output voltages, and lower internal power losses. Prior art multi-cell devices use physical isolation to achieve electrical isolation between cells. In order to fabricate a multicell device on a common substrate, the individual cells must be electrically isolated from one another. In the prior art, isolation generally required creating a physical dielectric barrier between the cells, which adds complexity and cost to the fabrication process. The disclosed technology achieves electrical isolation without physical isolation by proper orientation of interdigitated junctions such that the diffusion fields present in the interdigitated region essentially prevent the formation of a significant parasitic current which would be in opposition to the output of the device.

Method and structure for multicell devices without physical isolation

A device, method and process of fabricating an interdigitated multicell thermo-photo-voltaic component that is particularly efficient for generating electrical energy from photons in the red and near-infrared spectrum received from a heat source in the near field. Where the absorbing region is germanium, the device is capable of generating electrical energy by absorbing photon energy in the greater than 0.67 electron volt range corresponding to radiation in the infrared and near-infrared spectrum. Use of germanium semiconductor material provides a good match for converting energy from a low temperature heat source. The side that is opposite the photon receiving side of the device includes metal interconnections and dielectric material which provide an excellent back surface reflector for recycling below band photons back to the emitter. Multiple cells may be fabricated and interconnected as a monolithic large scale array for improved performance.

Lateral photovoltaic device for near field use

An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.

Submicron gap thermophotovoltaic structure and fabrication method

An improved submicron gap thermophotovoltaic structure and method comprising an emitter substrate with a first surface for receiving heat energy and a second surface for emitting infrared radiation across an evacuated submicron gap to a juxtaposed first surface of an infrared radiation-transparent window substrate having a high refractive index. A second surface of the infrared radiation-transparent substrate opposite the first surface is affixed to a photovoltaic cell substrate by an infrared-transparent compliant adhesive layer. Relying on the high refractive index of the infrared radiation-transparent window substrate, the low refractive index of the submicron gap and Snell's law, the infrared radiation received by the first surface of the infrared radiation-transparent window substrate is focused onto a more perpendicular path to the surface of the photovoltaic cell substrate. This results in increased electrical power output and improved efficiency by the thermophotovoltaic structure.

Submicron gap thermophotovoltaic structure and method

Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabrication method therefor

A near-field energy conversion method, utilizing a sub-micrometer 'near-field' gap between juxtaposed infrared radiation receiver and emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure for maintaining uniform gap separation. Thermally resistant gap spacers are also used to maintain uniform gap separation. Means are provided for cooling a receiver substrate structure and for conducting heat to an emitter substrate structure. The gap may also be evacuated for more effective operation.

Method and structure for providing a uniform micron/sub-micron gap separation within micro-gap thermophotovoltaic devices for the generation of electrical power

A near-field energy conversion structure and method of assembling the same, utilizing a sub-micrometer 'near field' gap between juxtaposed photocell infrared radiation receiver and heat emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure.

Method and structure, using flexible membrane surfaces, for setting and/or maintaining a uniform micron/sub-micron gap separation between juxtaposed photosensitive and heat-supplying surfaces of photovoltaic chips and the like for the generation of electrical power

A method of making a micron gap thermal photovoltaic device includes forming at least one standoff on a photovoltaic substrate, depositing a sacrificial layer on the photovoltaic substrate and about the standoff, forming an emitter attached to the standoff and having a lower planar surface separated from the photovoltaic substrate by the sacrificial layer, and removing the sacrificial layer to form a sub-micron gap between the photovoltaic substrate and the lower planar surface of the emitter.

Micron gap thermal photovoltaic device and method of making the same

A method of making a micron gap thermal photovoltaic device wherein at least one standoff is formed on a photovoltaic substrate, a sacrificial layer is deposited on the photovoltaic substrate and about the standoff, an emitter is attached to the standoff and has a lower planar surface separated from the photovoltaic substrate by the sacrificial layer, and the sacrificial layer is removed to form a sub-micron gap between the photovoltaic substrate and the lower planar surface of the emitter.

Three magnetic substrates are provided, the first substrate forms the rotor and the other two form the outer stator. A series of spaced concentric grooves and spaced spiral grooves are formed in the central region of both faces of the first substrate. A hole is placed at the center of the spiral grooves, and filled with magnetic material. A conductor is then deposited into the spiral grooves, forming a central wheel. A series of spaced serpentine grooves and generally radial grooves are formed on each active face of the other two substrates. A conductor is then deposited into the serpentine grooves, and a magnetic material is deposited into the generally radial grooves. The two outer substrates are then bonded against the first substrate such that the outer end of each magnetic path overlays a filled hole in the first substrate, creating the stator of an axial air gap reluctance motor.

Method of fabricating a rate gyroscope and accelerometer multisensor

This invention relates to the fabrication of planar inductive components whereby the design in cross-section describes a conductor surrounded by magnetic material along the length of the conductor; an electrical insulator is placed between the conductor and the magnetic material. Cases also apply where more than one independent conductor is used. The planar form allows integration of inductive components with integrated circuits. These inductive components can be embedded in other materials. They can also be fabricated directly onto parts.

Fabrication approaches for the formation of planar inductors and transformers

A hybrid wafer gyroscope includes a combination of micro-machined components and traditional electromechanical components to form a miniature gyroscope having a high degree of stability. The gyroscope includes a rotor, gimbal, flexures, and stop cutouts micro-machined out of one or more layers of silicon, forming a unitary, planar, and disk-shaped rotor subassembly, which spins about a drive shaft.

Hybrid wafer gyroscope

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Wayland, MA, United States of America

Paul Greiff