Intel Corporation

Paul Gauche

Efraim Rotem

Rajiv K Mongia

Robert T Jackson

Alex Waizman

A package includes a thermal solution to thermal couple to a semiconductor device to remove heat generated by the semiconductor device, and a device to electrically isolate at least a portion of the thermal solution from the semiconductor device. The package also includes a biasing device to apply a voltage to a body of the semiconductor device.

Method and apparatus for electrical isolation of semiconductor device

According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a laptop computer. The arrangement includes a heat spreader having a first section including at least one thermally conductive coupling member to thermally engage surfaces of electronic components on the heat-generating device and a second section including at least one spring member to cause pressurized engagement between the first section and the surfaces of the electronic components. The heat spreader may further be thermally coupled to a heat exchanger or a keyboard from which the heat is dissipated. Other embodiments are also described and claimed.

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Portland, OR, United States of America

Paul Gauche