Monolithic 3d Inc.

Bae Systems Imaging Solutions Inc.

Paul G Lim

Zvi Or-Bach

Deepak Chandra Sekar

Brian Cronquist

Israel Beinglass

Hung T Do

Ze'ev Wurman

Alberto M Magnani

Chenguang Gong

Jan Lodewijk De Jong

Stephen W Mims

J L De Jong

An imaging array and a pixel sensor are disclosed. One of the pixel sensors in the imaging array includes a photodiode having a cathode connected to an electron storage node and an anode connected to a hole storage node. An overflow path connects the electron storage node via an overflow gate that allows electrons to leak off of the electron storage node into the overflow path if the electron storage node has a potential less than a leakage potential. A floating diffusion node is connected to the electron storage node by a transfer gate and the overflow path by an overflow path gate. A hole storage node reset gate connects the hole storage node to ground. A hole storage capacitor is connected between the hole storage node and ground, and an overflow path coupling capacitor connects the hole storage node to the overflow path.

Small pixel high dynamic range pixel sensor

A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including an optical waveguide, where the second level is disposed above the first level, where the first level includes crystalline silicon; and an oxide layer disposed between the first level and the second level, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.

Multilevel semiconductor device and structure

An imaging array having a plurality of pixel sensors connected to a bit line is disclosed. Each pixel sensor includes a capacitive overflow pixel sensor characterized by an overflow capacitor having a switching terminal, and a floating diffusion node, a buffer amplifier that connects the floating diffusion node to a bit line in response to row select signal, and a switch that connects the switching terminal to either ground or a boost voltage. The imaging array also includes a switch controller that controls the switch and is connected to the bit line, the switch controller determining a voltage on the bit line, the switch controller connecting the switching terminal to the boost voltage during an exposure of the pixel sensor to light and to either ground or the boost voltage during a readout of charge stored on the overflow capacitor depending on the voltage on the bit line.

Ultra-high dynamic range CMOS sensor

An imaging array having a plurality of pixel sensors connected to a bit line is disclosed. Each pixel sensor includes a first photodetector having a photodiode, a floating diffusion node, and an amplifier. The floating diffusion node is characterized by a parasitic photodiode and parasitic capacitance. The amplifier amplifies a voltage on the floating diffusion node to produce a signal on an amplifier output. The first photodetector also includes a bit line gate that connects the amplifier output to the bit line in response to a row select signal and a voltage dividing capacitor having a first terminal connected to the floating diffusion node and a second terminal connected to a drive source that switches a voltage on the second terminal between a drive potential different from ground and ground in response to a drive control signal.

Global shutter scheme that reduces the effects of dark current

A semiconductor device includes a first mono-crystallized layer including first transistors, and a first metal layer forming at least a portion of connections between the first transistors; and a second layer including second transistors, the second transistors including mono-crystalline material, the second layer overlying the first metal layer, wherein the first metal layer includes aluminum or copper, and wherein the second layer is less than one micron in thickness and includes logic cells.

Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer

A camera system including, a first image sensor array and a second image sensor array wherein the first image sensor array is designed for a first focal plane in front of the camera, and the second image sensor array is designed for a second focal plane in front of the camera, wherein the distance to the first focal plane is substantially different than the distance to the second focal plane.

Semiconductor and optoelectronic devices

A 3D semiconductor device, including: a first layer including first transistors; a first interconnection layer interconnecting the first transistors and includes aluminum or copper; a second layer including second transistors; where the second transistors are aligned to the first transistors with a less than 40 nm alignment error, and where the second layer is overlying the first interconnection layer, and where at least one of the second transistors has a back-bias structure designed to modify the performance of at least one of the second transistors.

3D semiconductor device and structure with back-bias

A semiconductor device, including: a first semiconductor layer including first transistors, wherein the first transistors are interconnected by at least one metal layer including aluminum or copper; and a second mono-crystallized semiconductor layer including second transistors and overlaying the at least one metal layer, wherein the at least one metal layer is in-between the first semiconductor layer and the second mono-crystallized semiconductor layer, wherein the second mono-crystallized semiconductor layer is less than 100 nm in thickness, and wherein the second transistors include horizontally oriented transistors.

Semiconductor device and structure

An Integrated device comprising a first monocrystalline layer comprising logic circuit regions and a second monocrystalline layer comprising memory regions constructed above first monocrystalline layer, wherein the memory regions comprise second transistors, wherein said second transistors comprise drain and source that are horizontally oriented with respect to the second monocrystalline layer, and a multiplicity of vias through the second monocrystalline layer providing connections between the memory regions and the logic circuit regions, wherein at least one of the multiplicity of vias have a radius of less than 100 nm.

A semiconductor device including a first layer including first transistors, wherein first logic circuits are constructed by the first transistors, and wherein the first logic circuits include at least one of Inverter, NAND gate, or NOR gate; and a second layer overlaying said first layer, the second layer including second transistors, wherein second logic circuits are constructed by the second transistors; wherein each logic circuit in the first logic circuits has inputs and at least one first output, the inputs are connected to the second logic circuits; wherein each logic circuit in the second logic circuits has a second output, and wherein the first transistors include first selectors adapted to selectively replace at least one of the at least one first outputs with at least one of the second outputs.

A method to fabricate a junction-less transistor comprising: forming at least two regions of semiconductor doping; first region with a relatively high level of dopant concentration and second region with at least 1/10 lower dopant concentration, and etching away a portion of said first region for the formation of the transistor gate.

Method for fabrication of a semiconductor device and structure

A method of manufacturing a semiconductor device, the method including, providing a first monocrystalline layer including semiconductor regions, overlaying the first monocrystalline layer with an isolation layer, transferring a second monocrystalline layer comprising semiconductor regions to overlay the isolation layer, wherein the first monocrystalline layer and the second monocrystalline layer are formed from substantially different crystal materials; and subsequently etching the second monocrystalline layer as part of forming at least one transistor in the second monocrystalline layer.

Growing community of inventors

Fremont, CA, United States of America

Paul G Lim