3m Innovative Properties Company

3m Innovative Properties

Paul Frederic Baude

Michael Albert Haase

Fred Boyle McCormick

Martin B Wolk

Yong Hsu

Steven D Theiss

Jeffrey M Florczak

Patrick R Fleming

Tommie W Kelley

Dawn V Muyres

George D Vernstrom

Eric W Hemmesch

Michael C Palazzotto

Sergey Lamansky

Manoj Nirmal

Thomas James Miller

William A Tolbert

Stefan H Gryska

Myungchan Kang

Yaoqi Joe Liu

Tzu-Chen Lee

Silva K Theiss

Ha T Le

Russell Dean Birkholz

Steven D Thelss

Fred B Mccormick

A sensor element includes a first conductive electrode having a first conductive member electrically coupled thereto; an absorptive dielectric layer comprising a polymer of intrinsic microporosity; and a second conductive electrode having a second conductive member electrically coupled thereto. The second conductive electrode comprises at least one noble metal, has a thickness of from 4 to 10 nanometers and is permeable to at least one organic vapor. The absorptive dielectric layer is at least partially disposed between the first conductive electrode and the second conductive electrode. A method of making the sensor element, and sensor device containing it, are also disclosed.

Sensor element, method of making the same, and sensor device including the same

Encapsulated organic electronic devices including organic light emitting diodes are made using an adhesive component as a mask while the device is being constructed. An adhesive-coated liner can be applied to the device substrate and openings created therein by removing portions of the liner and adhesive, or a patterned adhesive layer having openings therein can be formed on the device substrate, followed by deposition of the device layers and application of a sealing layer.

Encapsulated organic electronic devices and method for making same

Methods of forming displays are described. The displays have zinc oxide row and column drivers integrated onto the same display substrate as zinc oxide pixel transistors and organic light emitting diodes. The organic light emitting diodes are prepared, at least in part, using a thermal transfer process from a donor sheet.

Methods of making displays

A method of making a patterned layer comprises directing a beam of vaporized material toward a reflector such that the beam of vaporized material impinges an impingement surface of the reflector and is redirected from the reflector through one or more apertures in a shadow mask and onto a deposition substrate to form a patterned material layer.

Method for making a thin film layer

The use of an alternating current (ac) source to power logic circuitry can support satisfactory device performance for a variety of applications, while enhancing long-term stability of the circuitry. For example, when organic thin film transistor (OTFT)-based logic circuitry is powered by an ac power source, the logic circuitry exhibits stable performance characteristics over an extended period of operation. Enhanced stability may permit the use of OTFT logic circuitry to form a variety of circuit devices, including inverters, oscillators, logic gates, registers and the like. Such circuit devices may find application in a variety of applications, including integrated circuits, printed circuit boards, flat panel displays, smart cards, cell phones, and RFID tags. In some applications, the ac-powered logic circuitry may eliminate the need for ac-dc rectification components, thereby reducing the manufacturing time, expense, cost, complexity, and size of the component carrying the circuitry.

Ac powered logic circuitry

A method for circuit fabrication includes positioning first and second webs of film in proximity to each other, wherein the second web of film defines a deposition mask, and deposition material on the first web of film through the deposition mask pattern defined by the second web of the to create at least a portion of an integrated circuit.

In-line deposition processes for circuit fabrication

Methods and displays utilize row and column drivers with ZnO channels that control pixel transistors with ZnO channels, which in turn address OLEDs of an array to produce images of a display screen. A display backplane including the ZnO row and column drivers and the OLEDs may be constructed by utilizing aperture masking or a combination of photolithography and aperture masking. Monolithic integration of the ZnO row and column drivers together with the ZnO pixel transistors is thereby achieved.

Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes

Logic circuitry is powered by a partially rectified alternating current (ac) waveform. The waveform is partially rectified in the sense that it does not provide a clean, primarily dc power signal. Instead, it is possible to power logic circuitry with a waveform that includes a substantial ac component. The partially rectified ac waveform may be applied to logic circuitry incorporating thin film transistors based on amorphous or polycrystalline organic semiconductors, inorganic semiconductors or combinations of both.

Logic circuitry powered by partially rectified AC waveform

Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for electronic displays and low-cost integrated circuits such as radio frequency identification (RFID) circuits. In addition, the techniques can be advantageous in the fabrication of integrated circuits incorporating organic semiconductors, which typically are not compatible with wet processes.

Aperture masks for circuit fabrication

An organic Schottky diode includes a polycrystalline organic semiconductor layer with a rectifying contact on one side of the layer. An amorphous doped semiconductor layer is placed on the other side of the polycrystalline organic semiconductor layer, and it acts as a buffer between the semiconductor layer and an ohmic contact layer.

Organic Schottky diode

AC powered logic circuitry

Logic circuitry powered by partially rectified ac waveform

Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.

Encapsulation of organic electronic devices using adsorbent loaded adhesives

Encapsulated organic electronic devices including organic light emitting diodes are made using an adhesive component as a mask while the device is being constructed. An adhesive-coated liner can be applied to the device substrate and openings created therein by removing portions of the linear and adhesive, or a patterned adhesive layer having openings therein can be formed on the device substrate, followed by deposition of the device layers and application of a sealing layer.

Growing community of inventors

Maplewood, MN, United States of America

Paul Frederic Baude