International Business Machines Corporation

Globalfoundries Inc.

Afl Telecommunications Lcc

Jds Uniphase Corporation

Paul Francis Fortier

Tymon Barwicz

Elaine Cyr

Alexander Janta-Polczynski

Nicolas Boyer

Russell Alan Budd

Benjamin V Fasano

Benson Chan

John Henry Sherman

Barnim Alexander Janta-Polczynski

Stephan L Martel

Stephane G Harel

Hilton T Toy

Koji Masuda

Glen Walden Johnson

Francois Guindon

Patrick Jacques

Masao Tokunari

Richard D Langlois

Jerome Bougie

Roch Thivierge

Darrell Randolph Childers

Frank Robert Libsch

Alan Frederic Benner

Takashi Hisada

Ladd William Freitag

Real Joseph Tetreault

Martial A Letourneau

Jeffrey P Gambino

Bing Dang

Paul Stephen Andry

Thomas Weiss

Yurii A Vlasov

Shidong Li

Ted Lichoulas

Thomas Edward Lombardi

David Hirsch Danovitch

Gerald Daniel Malagrino, Jr

Edmund D Blackshear

Luc Gilbert Guerin

Sylvain E Ouimet

James Robert Moon

Marcus E Interrante

Roger Lam

Dominique L Demers

Gary T Galli

Joseph Paul Kuczynski

Qizhi Liu

Timothy Harrison Daubenspeck

Wolfgang Sauter

Timothy Dooling Sullivan

Christopher David Muzzy

Jae-Woong Nah

Robert K Leidy

David L Questad

How Tzu Lin

Richard Ronald Hall

Kang-Wook Lee

Richard John Rassel

Jean Audet

Chirag Suryakant Patel

Mitchell S Cohen

Marie-Claude Paquet

Soojae Park

Isabel De Sousa

David R Motschman

Sylvain Pharand

Maryse Cournoyer

Louis-Marie Achard

Dany Minier

Pascal P Blais

Roxan Lemire

James Earl Olson

Frank F Libsch

Brett Cucci

Simon LaFlamme

Guy Brouilette

Jean-Francois Morissette

Robert L Toutant

Alain A Warren

Chrirag S Patel

Vincent Langlois

A structural feature of an optical connector assembly in which an optical chip is connectable with a fixed ferrule via a waveguide and is joined onto a section of a substrate. The structural feature includes a structural section disposed on one of the optical chip and the substrate and a ferrule support section that extends from the structural section and comprises a surface for adhesion to the fixed ferrule.

High-bandwidth embedded optical connector with latching mechanism

A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.

Photonics package with face-to-face bonding

Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.

Pluggable LGA socket for high density interconnects

Systems and methods are provided for obtaining measurements of an integrated circuit chip and a connected carrier to obtain the measurements of the interconnect heights. More specifically, a method is provided that includes defining a top best fit reference plane and a bottom best fit reference plane, and adjusting the top best fit reference and the bottom best fit reference to be superposed to one another. The method further includes calculating first distances between each height measurement for a first set of points and the adjusted top best fit reference plane, and calculating second distances between each height measurement for a second set of points and the adjusted bottom best fit reference plane. The method further includes calculating height values of a gap or interconnect between the first substrate and the second substrate by subtracting the thickness of the first substrate and the second distances from the first distances.

Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect

An optical device includes: a substrate including plural waveguide cores; and an optical component provided on the substrate, the optical component including plural lenses, each of the plural lenses transmitting light passing through one of the corresponding plural waveguide cores on the substrate. The substrate and the optical component are each provided with a positioning structure. The positioning structure includes plural protrusions and plural recesses provided on the substrate and the optical component. Each of the plural recesses accommodates a corresponding one of the plural protrusions, and an outer surface of each of the plural protrusions contacts a positioning surface of a corresponding one of the plural recesses. The positioning surface is a part of an inner surface of each of the plural recesses having accommodated the corresponding one of the plural protrusions to position the plural lenses relative to the substrate.

Microlens array assembling process

An optical device includes a substrate including plural waveguide cores and an optical component provided on the substrate. The plural waveguide cores allowing light to pass through the plural waveguide cores and the optical component including plural lenses Each of the plural lenses transmitting light passing through a corresponding one of the plural waveguide cores on the substrate, wherein the optical component includes a body and a protrusion The body being provided with the plural lenses, the protrusion being protruded from a side of the body, and the protrusion is fixed to the substrate with an adhesive.

Optical device with adhesive connection of recess or side protrusion

An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.

Fluid control structure

An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.

Fiber attach assembly and test automation

Systems and methods for nanofiller in an optical interface are provided. One system includes a fiber-optic interface for one or more optical fibers that includes a body including one or more grooves defined therein. At least one groove in the one or more grooves is configured to receive a corresponding optical fiber of the one or more optical fibers. The at least one groove of the one or more grooves is further configured to receive an adhesive to attach the body to a portion of the corresponding optical fiber. Further, fiber-optic interface includes a suspended structure associated with the at least one groove configured to couple light between the suspended structure and the corresponding optical fiber. Also, the adhesive comprises nanofiller configured to support an alignment of the suspended structure with the corresponding optical fiber within the at least one groove.

Nanofiller in an optical interface

A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.

Optical interconnect attach to photonic device with partitioning adhesive function

A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.

Connecting mid-board optical modules

Growing community of inventors

Richelieu, Canada

Paul Francis Fortier