Laird Technologies Gmbh

Paul Francis Dixon

Mohammadali Khorrami

John Song

George William Rhyne

Gerald Robert English

Yoeri Ariën

According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.

Thermally-conductive electromagnetic interference (EMI) absorbers positioned or positionable between board level shields and heat sinks

According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.

Board level shields with virtual grounding capability

According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).

Soft and/or flexible EMI shields and related methods

Exemplary embodiments are provided of absorber assemblies having dielectric spacers. In an exemplary embodiment, an absorber assembly includes a printed circuit board and a differential line disposed on the printed circuit board. The differential line includes a first trace and a second trace opposite the first trace. The assembly also includes a dielectric spacer coupled to the printed circuit board and covering at least a portion of the differential line, and an absorber coupled to the dielectric spacer to inhibit electromagnetic interference radiation from the differential line. Example methods of assembling an electromagnetic interference radiation absorber assembly for a differential line are also disclosed.

Absorber assemblies having a dielectric spacer, and corresponding methods of assembly

According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.

Thermal interface materials including electrically-conductive material

According to various aspects, exemplary embodiments include one or more frequency selective structures (e.g., two-dimensional or three-dimensional frequency selective structure or surface, etc.), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.

Frequency selective structures for EMI mitigation

According to various aspects, exemplary embodiments include one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals.

Cavity resonance reduction and/or shielding structures including frequency selective surfaces

According to various aspects, exemplary embodiments are disclosed of shielding structures including one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures.

Growing community of inventors

Sharon, MA, United States of America

Paul Francis Dixon