Advanced Powertrain Engineering, LLC

Raytech Innovative Solutions, LLC

Raytech Innovation Solutions, LLC

Paul Fathauer

Richard D Cooper

David Perry

Angela L Petroski

James P Macey

Angela Mroczek-Petroski

Marc Andrew Yesnik

Richard D Copper

James J Petroski

Printed circuit for an automatic transmission solenoid module

A method of rebuilding a pressure control solenoid includes uncrimping a housing of the solenoid, and disassembling the solenoid. An original spool valve of the solenoid is removed from a hydraulic bore of the solenoid. The hydraulic bore is reamed such that an inner diameter of the bore is enlarged. A replacement spool valve is inserted into the hydraulic bore. An outer diameter of the replacement spool valve is larger than an outer diameter of the original spool valve.

Solenoid rebuilding method for automatic transmissions

A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

Printed circuit assembly for a solenoid module for an automatic transmission

A retaining clip that provides a method for securing electrical connections between male and female electrical connectors is disclosed. Current locking mechanisms are on both the electrical plug and the connector. These locking mechanisms often break when disconnecting the plug. Some embodiments of the present invention eliminate the need for the locking mechanisms. Furthermore, in cases where the mechanisms have been broken, some embodiments provide a method for reusing the electrical plug and/or the connector.

Retaining clip for electrical connectors

A method of rebuilding a solenoid for use in automatic transmissions is disclosed. In one embodiment, an improvement over the original equipment design allows for increased durability of the solenoid. In another embodiment, a lower cost method is disclosed for reusing an expensive component. In either case, various components within the solenoid are reused, reconditioned or replaced. A preferred process for disassembling the solenoid is also disclosed.

Method of rebuilding solenoids for automatic transmissions

A retaining clip that provides a method for securing electrical connections between a male and female electrical connectors is disclosed. Current locking mechanisms are on both the electrical plug and the connector. These locking mechanisms often break when disconnecting the plug. Some embodiments of the present invention eliminate the need for the locking mechanisms. Furthermore, in cases where the mechanisms have been broken, some embodiments provide a method for reusing the electrical plug and/or the connector.

A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.

Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same

A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.

Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers

A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.

Retaining ring with wear pad for use in chemical mechanical planarization

The present invention is related to a method for securing a polishing pad to the platen for use in chemical-mechanical polishing. Specifically, a polishing pad is attached to a platen using a reclosable, hook-and-pile fastener, whereby the platen-attachment fastener may be reused. Separate embodiments are disclosed for attaching porous and nonporous polishing pads.

Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers

A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.

Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making

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Sullivan, IN, United States of America

Paul Fathauer