North American Philips Corporation

Control Data Corporation

Paul F Michalek

William P Wood

John A Rice

John Kirchberg

Richard A Strom

Terry Mitchell

Terry B Mitchell

Clark Bergman

A surface smooth enough to allow the formation thereon of a single domain magnetic element is obtained by covering a polished layer with a thin layer of the same material, to smooth sharp edges and corners. The resulting structure is useful in thin film magnetic heads.

Composite structure with single domain magnetic element, and thin film

A combined read/write magnetic head is disclosed in which the read head includes a magnetoresistive element (MRE) overlying a substrate of substantially magnetically impermeable material, a broken (discontinuous) flux guide overlying the MRE and a continuous flux guide overlying the broken flux guide. The write head of the combined read/write magnetic head overlies the read head and shares the continuous flux guide with the read head, the continuous flux guide serving as a bottom pole of the write head. Significantly, the dimensions of the various elements of the combined read/write magnetic head are chosen so that relatively little magnetic flux produced by the write head during writing, or entering the write head during reading, is communicated via the shared flux guide to the MRE.

Combined read/write magnetic head having MRE positioned between broken

Method of making composite structure with single domain magnetic element

Thin film magnetic head structure includes digital read/write heads and analog read heads integrated on a single substrate. The 'wrap around pole effect' is reduced or eliminated by having the thicknesses of the digital lower flux guides and the analog read gap-defining layer approximately the same, resulting in improved signal output from the digital read heads. The structure is useful in cassette decks designed to play both digital and analog compact cassettes.

Integrated thin film magnetic head with planar structure

This is a system for connecting flexible electrical connectors having raised conductors above an insulating substrate to a plasma display panel having a glass substrate with the electrical conductors deposited in the bottom surface of conductor pathways etched in a glass substrate. The raised conductors on the connectors mate with the depressed conductors in the panel substrate. The spacing of the conductors in the connector may be varied to facilitate an exact mating with the conductors in the panel substrate. A clip device in combination with a flexible insulating force spreading member applies a uniform continuous pressure to the connector cable and glass substrate combination to maintain connection. This system may be used to facilitate the direct attachment of large scale integrated circuit chip carriers having conductor members on a surface thereof directly to conductors in a plasma display panel substrate.

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Bloomington, MN, United States of America

Paul F Michalek