X Development LLC

Paul Epp

Devin Brinkley

Baris Ibrahim Erkmen

Andrei Stefan Kazmierski

Nam-hyong Kim

John Moody

Joaquin Matres Abril

A method of calibrating a collimating lens system includes transmitting, using an optical transmitter, a beam out of an optical fiber and through a collimating lens of the collimating lens system. The beam is reflected off a perfect flat mirror positioned at an output of the collimating lens and back towards the collimating lens, and received, via the collimating lens, at a power meter connected to the optical fiber. The method also includes adjusting a position of a tip of the optical fiber proximal to the collimating lens while tracking a power reading using the power meter, selecting a calibration position of the optical fiber corresponding to a highest power reading, and securing the optical fiber relative to the collimating lens using the calibration position.

Method of precision beam collimation using fiber-optic circulator and wavelength tunable source

An optical phased array (OPA) photonic integrated chip includes a plurality of array elements, a plurality of phase shifters, a plurality of combiners, and an edge coupler configured to couple to a single mode waveguide. The plurality of phase shifters includes a layer of phase shifters that has a phase shifter connected to each array element in the plurality of array elements. The plurality of combiners is configured to connect the plurality of phase shifters to the edge coupler. The plurality of combiners includes a first combiner that has a first output that is connected to a second combiner or the edge coupler, and a second output of the first combiner is connected to a photodetector. An in-phase light portion at the first combiner is output through the first output, and an out-of-phase light portion at the first combiner is output through the second output.

Optical phased array architecture for wavefront sensing

A system includes a transmitter configured to output an optical signal. The transmitter includes a seed laser, an optical array including a plurality of array elements, and a plurality of phase shifters in a multi-layer arrangement. The multi-layer arrangement includes a plurality of layers between the seed laser and the optical array, wherein a first layer of the plurality of layers transmits light to a second layer of the plurality of layers. The first layer has fewer phase shifters than the second layer. The multi-layer arrangement also includes a plurality of branches wherein each branch includes a phase shifter from each of the plurality of layers connected in series between the seed laser and one of the plurality of array elements. Each phase shifter is configured to shift the optical signal incrementally to amass a total phase shift for each of the plurality of array elements.

Phase shifter architecture for large-element-count optical phased arrays

Aspects of the disclosure provide a system including a first communications terminal. The first communications terminal may include an optical phased array (OPA) including a plurality of phase shifters configured to receive an optical communications beam from a second communications terminal. The first communications terminal may also include one or more processors configured to determine a link axis for communication with the second communications terminal based on the received optical communications beam, identify a compensatory wavefront curvature for mitigating cross-coupling, and generate a wavefront of an outgoing optical communications beam using the plurality of phase shifters based on the determined link axis and the compensatory wavefront curvature.

Mitigating cross-coupling in optical communications system

A free-space optical communication system includes an optical phased array (OPA) photonic integrated chip, a transceiver photonic integrated chip, and one or more processors. The OPA chip includes a plurality of array elements and a plurality of phase shifters. The transceiver chip includes one or more transmitter components and one or more receiver components. The one or more processors are configured to transmit a first signal via the OPA chip and the transceiver chip, and receive a second signal via the OPA chip and the transceiver chip.

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Sunnyvale, CA, United States of America

Paul Epp