Varian Semiconductor Equipment Associates, Inc.

Applied Materials, Inc.

Nuventix, Inc.

Eastman-Kodak Company

Paul E Pergande

William Tyler Weaver

Jason M Schaller

Robert Brent Vopat

David T Blahnik

Benjamin B Riordon

Charles T Carlson

Raghavendran Mahalingam

Daniel N Grimm

John Stanley Booth

Lee M Jones

Morgan Evans

Julian G Blake

James D Strassner

Aaron Webb

Kosta S Selinidis

Ala Moradian

Paul Forderhase

Gary Wyka

Paul N Winberg

Krag R Senior

Homero Saldana

Jack J LoPiccolo

A contactless temperature sensor for measuring the temperature of a workpiece is disclosed. The contactless temperature sensor uses a cushion of gas to separate the bottom surface of the workpiece from the top surface of the temperature sensor. The contactless temperature sensor includes a puck having a conduit therethrough. The conduit has a first portion having a first diameter, and a second portion having a second, narrower diameter. A gas tube rests in the first portion of the conduit, disposed proximate the bottom surface of the puck. Since the puck is not affixed to the gas tube, angular compliance may be achieved between the workpiece and the puck. Gas passes through the second portion and to the top surface of the puck. This gas provides a cushion between the top surface of the puck and the underside of the workpiece and conducts heat from the workpiece to the puck.

Contactless workpiece temperature sensor

Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

Batch heating and cooling chamber or loadlock

Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

Buffer chamber wafer heating mechanism and supporting robots

A modular LED heater and an LED array are disclosed. The modular LED heater comprises a base having one or more internal conduits through which a coolant fluid may flow. The base also includes a plumbing port on one side wall of the base and a recessed port on an opposite side of the base. These ports are configured such that the plumbing port of one modular LED heater can be inserted into the recessed port of the adjacent modular LED heater to form a fluid-tight seal. A printed circuit board having a plurality of LEDs is disposed on the front surface of the base. Further, in some embodiments, the base includes one or more wedge clamps on its side walls used to lock the modular LED heater to an adjacent modular LED heater. An LED array may be created by assembling a plurality of these modular LED heaters.

Modular LED heater

Provided herein are approaches for cooling a process chamber window. In some embodiments, a system for process chamber window cooling may include a process chamber for processing a wafer, wherein the process chamber includes a window. In some embodiments, the window allows light from a lamp assembly to be delivered to the wafer. The system further includes a cooling apparatus operable with the process chamber, the cooling apparatus for delivering a gas to the window. The cooling apparatus includes a support ring supporting the window. The support ring includes a perimeter wall, and a plurality of slots formed through the perimeter wall. The plurality of slots may deliver a gas (e.g., air) across the window.

System and apparatus for process chamber window cooling

A workpiece support, such as an end effector, is coated on at least one of its surfaces with an anti-reflective material. The anti-reflective material improves the transmission of light through the workpiece support. The workpiece support may be disposed in a chamber, with heating elements disposed beneath the workpiece support, such that the workpiece support is disposed between the heating elements and the workpiece. In certain embodiments, the heating elements may be LEDs or tungsten halogen lamps. The anti-reflective material allows more efficient energy transfer from the heating elements to the workpiece. This may result in improved temperature uniformity across the workpiece. The anti-reflective material may be magnesium fluoride or a multi-layer optical coating. Alternatively, the heating elements may be disposed above the workpiece. In this case, the reduced reflection from the workpiece support may minimize the temperature increase on the portion of the workpiece disposed above the workpiece support.

Anti-reflective coating for transparent end effectors

A system and method for heating silicon carbide substrates is disclosed. The system includes a heating element that utilizes LEDs that emit light at wavelengths between 600 nm and 650 nm. This wavelength is better absorbed by silicon carbide. In certain embodiments, collimating optics are disposed between the LEDs and the silicon carbide substrate. The collimating optics may increase the allowable distance between the LEDs and the substrate. In other embodiments, a diffuser is disposed between the LEDs and the substrate. In addition, a method of heating a substrate is disclosed. The relationship between absorption coefficient and wavelength is determined for the substrate. Based on this relationship, an optimal wavelength or range of wavelengths is selected. The substrate is then heated using an LED emitting light at the optimal wavelengths.

Silicon carbide substrate heating

Apparatus and methods for heating and cooling a plurality of substrate wafers are provided. LED lamps are positioned against the back sides of a plurality of cold plates. In some embodiments, wafers are supported on a wafer lift which can move all wafers together. In some embodiments, wafers are supported on independent lift pins which can move individual wafers for heating and cooling. Some embodiments of the disclosure provide for decreased time between wafer switching in a processing chamber.

Batch LED heating and cooling chamber or loadlock

Buffer chamber wafer heating mechanism and supporting robot

An improved system for measuring the temperature of a plurality of workpieces in a rotating semiconductor processing device is disclosed. Because silicon has variable emissivity in the infrared band, a temperature stable, high emissivity coating is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. Further, by limiting the amount of coating applied to the workpiece, the effect of the coating on the intrinsic temperature of the workpiece and the surrounding semiconductor processing device may be minimized. The temperature of the workpieces is measured as the workpieces pass under an aperture by capturing a thermal image of a portion of the workpiece. In certain embodiments, a controller is used to process the plurality of thermal images into a single thermal image showing all of the workpieces disposed within the semiconductor processing device.

System and method to monitor semiconductor workpiece temperature using thermal imaging

A self-damping end effector including a base, a finger extending from the base and adapted to support a substrate, and a damper associated with the finger, the damper having a natural frequency within a predetermined tolerance of a natural frequency of the finger.

Self-damping end effector

An electrostatic chuck with LED heating is disclosed. The electrostatic chuck with LED heating comprises a first subassembly, which comprises a LED heater, and a second subassembly, which comprises an electrostatic chuck. The LED substrate heater subassembly includes a base having a recessed portion. A plurality of light emitting diodes (LEDs) is disposed within the recessed portion. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The second subassembly, which comprises an electrostatic chuck, is disposed on the LED substrate heater subassembly. The electrostatic chuck includes a top dielectric layer and an interior layer that are transparent at the wavelength emitted by the LEDs. One or more electrodes are disposed between the top dielectric layer and the interior layer to create the electrostatic force.

Electrostatic chuck with LED heating

A composite end effector including a lower sandwich panel having a first side and a second side opposite the first side, an upper sandwich panel having a first side and a second side opposite the first side, wherein the first side of the upper sandwich panel is bonded to the first side of the lower sandwich panel, and an intermediate element disposed between the second side of the lower sandwich panel and the second side of the upper sandwich panel. The intermediate element may include an electrical conductor, wherein an electrostatic chuck is electrically coupled to the electrical conductor through an aperture in the upper sandwich panel. Alternatively or additionally, the intermediate element may include a pair of optical fibers disposed within a pair of channels formed in at least one of the first side of the upper sandwich panel and the first side of the lower sandwich panel.

Composite end effector and method of making a composite end effector

An end effector pad including a fence member, a first recessed support member extending from a first side of the fence member, a second recessed support member extending from a second side of the fence member opposite the first side, a first glass plate having a relatively low coefficient of friction disposed on top of the first recessed support member for supporting a substrate thereon, and a second glass plate having a relatively low coefficient of friction disposed on top of the second recessed support member for supporting a substrate thereon.

Growing community of inventors

Austin, TX, United States of America

Paul E Pergande