Seagate Technology Incorporated

Paul E Gallup

Gordon Merle Jones

Joel William Hoehn

Yuhong Xiong

Jumna P Ramdular

Marc Ronshaugen

Kevin Lamber Mayer

Mohamed Salah H Khlif

An assembly includes a carrier device having proximal and distal ends. The carrier device includes a workpiece platform along the proximal end. The workpiece platform supports one or more slider bars. The carrier device attaches to a lapping machine. An adaptive component, including at least one spring, has a first portion that couples to the carrier device and a second portion that couples to a grinding-slicing machine.

Universal carrier device and adaptive components for the carrier device

A method is used for forming sliders for use in a disc drive actuation system. The method comprises providing a wafer formed of a substrate having a base coat and an overcoat. Wafer-level notch lanes having a first width extend across the wafer in a first direction. The overcoat is removed from the wafer-level notch lanes. The wafer is sliced along a portion of the wafer-level lanes through the base coat to form a channel. The wafer is mechanically sliced through the substrate along slice lanes that extend across the wafer in the first direction to differentiate the wafer into bars. The bars are cut in a second direction substantially perpendicular to the first direction to form the sliders.

Laser-assisted slicing of notched wafer

Growing community of inventors

New Hope, MN, United States of America

Paul E Gallup