Taiwan Semiconductor Manufacturing Comp. Ltd.

Paul Chu

Kun-Ming Huang

Ming-Yi Lin

Fu-Hsiung Yang

Long-Shih Lin

Cheng-Ming Wu

Chih-Wing Chang

Chiou-Sung Chiu

Some embodiments of the present disclosure relate to a method to increase breakdown voltage of a power device. A power device is formed on a silicon-on-insulator (SOI) wafer made up of a device wafer, a handle wafer, and an intermediate oxide layer. A recess is formed in a lower surface of the handle wafer to define a recessed region of the handle wafer. The recessed region of the handle wafer has a first handle wafer thickness, which is greater than zero. An un-recessed region of the handle wafer has a second handle wafer thickness, which is greater than the first handle wafer thickness. The first handle wafer thickness of the recessed region provides a breakdown voltage improvement for the power device.

Partial SOI on power device for breakdown voltage improvement

A substrate for an integrated circuit includes a device wafer having a raw carrier concentration and an epitaxial layer disposed over the device wafer. The epitaxial layer has a first carrier concentration. The first carrier concentration is higher than the raw carrier concentration.

Multiple layer substrate

A reticle for holding a mask thereon with reduced particle contamination problem is described. The reticle is constructed by a base plate that is formed of an optically transparent material such as quartz and has a recessed slot in a top surface to enclose an area at least the size of a mask formed on the base plate. An adhesive partially fills the recessed slot such that a top surface of the adhesive is at least 0.5 mm below the top surface of the base plate. A pellicle frame is mounted in the recessed slot with a bottom end of the frame encased in the adhesive and a thin film covering the top end of the pellicle frame to from a hermetically sealed cavity for protecting the mask.

Method for making reticles with reduced particle contamination and reticles formed

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Taipei, Taiwan

Paul Chu