Life Safety Distribution Ag

Honeywell International Inc.

Infineon Technologies Ag

International Rectifier Corporation

Paul Christopher Westmarland

Mark Pavier

Christoph Glacer

Ulrich Krumbein

David Tumpold

Bernd Goller

Dominic Maier

Keith Francis Edwin Pratt

John Chapples

Neils Hansen

Martin Jonathan Kelly

Neils Richard Stewart Hansen

Fuxia Liu

Johnny Jian

Peter R Ewer

Alberto Guerra

Stuart Cardwell

Stuart Alistair Harris

Tobias Mittereder

Dan Hawkinson

Tony Downer

Siyuan Qi

Scott Palmer

Arkadiusz Edward Majczak

Hugh Richard

A sound transducer device includes a multilayer component board having a first side and an opposite second side, and a sound port extending between the first and second sides of the multilayer component board. The sound transducer also includes a MEMS sound transducer die including a suspended membrane structure, wherein the MEMS sound transducer die is arranged at the first side of the multilayer component board such that the suspended membrane structure is in fluid communication with the sound port. The sound transducer also includes a mesh structure for providing an environmental barrier, the mesh structure covering the sound port from either one of the first and second sides of the multilayer component board.

Methods of environmental protection for silicon MEMS structures in cavity packages

Various example embodiments described herein relate to an electrochemical gas sensor. The electrochemical gas sensor can include a sensor cap having one or more solid features disposed on a surface of the sensor cap. The electrochemical gas sensor can include a counter electrode configured to generate a gas during use of the electrochemical gas sensor. The electrochemical gas sensor can include a vent assembly adapted to release at least a portion of the gas generated at the counter electrode out from the electrochemical gas sensor. The vent assembly can include a vent conduit and a vent membrane that defines a passage for the gas to flow from an extended portion of the counter electrode, to the vent conduit, via the vent membrane, so as to be vented from the electrochemical gas sensor.

Electrochemical gas sensor assembly

A package is disclosed. In one example, the package comprises a carrier, a semiconductor chip having a first connection area at which the semiconductor chip is mounted at a first vertical level on or above the carrier, and a connection body. The semiconductor chip is bent to thereby be connected at a second connection area of the semiconductor chip at a second vertical level, being different from the first vertical level, with the connection body.

Bending semiconductor chip for connection at different vertical levels

Embodiments of the disclosure relate to capillary controlled gas sensors comprising a top cap assembly, wherein the top cap assembly is operable to reduce the effects of condensation and pressure changes on the effectiveness of the gas sensor. The top cap assembly comprises a capillary controlled gas flow path, a bulk flow control assembly, and a raised boss surrounded by a moat.

Gas sensors with structure to resist signal losses due to condensation

A sensor with a sensor housing or body, a plastic molded table positioned in the sensor housing; and a counter electrode carried on a first end of the table.

Support for electrode stack and provision for venting of a gas sensor using an internally mounted table

A gas sensor is disclosed. The gas sensor includes a gas sensing electrode and a counter electrode disposed within a housing, and respective conductors that connects the gas sensing electrode and the counter electrode to a sensing circuit. The housing includes walls defining a cavity containing electrolyte in fluid communication with the gas sensing electrode and counter electrode and wherein the walls further comprise one or more coatings or second layers superimposed on the walls. The one or more coatings or second layers have a lower water vapor transport rate than that of the walls, such that, in use, water vapor transport between the electrolyte and atmosphere through the walls of the housing is reduced.

Low water vapour transfer coating of thermoplastic moulded oxygen gas sensors

A very high power semiconductor device package has a heavy flat conductive terminal which carries a semiconductor die. A thin conductive tab is disposed to be continuous with but insulated from the terminal and lies in a plane above the heavy flat terminal. A top electrode of the die is connected to the tab and an insulation housing encloses portions of the adjacent ends of the tab and terminal as well as the die and its connector leads. The free end of the tab may have printed circuit connection fingers. Two notches are cut into the sides of the thin tab at a location closely spaced from the surface of the housing through which the tab extends to provide stress relief for the insulation housing through which the tab extends.

High current semiconductor device package with plastic housing and conductive tab

Growing community of inventors

Surrey, United Kingdom

Paul Christopher Westmarland