Digital Equipment Corporation

Paul C Wade

Leslie R Fox

William L Schmidt

David J Sager

Samuel Hammond Duncan

Donald W Smelser

Jj Grady, Iii

Andrey Varpahovsky

A system and method that reduces the simultaneous switching noise of outputs and the processing delays caused by inductance by using an encoding scheme that results in a net signaling current of substantially zero at each cycle time for the fast parallel switching networks of digital integrated circuit chips and that provides multiple types of error detection.

System and method for error detection and reducing simultaneous

A method and device for receiving data in a synchronous communication system. Data can be accurately transferred between two subsystems in a synchronous system even where the clock skew and propagation delay between the two subsystems is unlimited. The receiving subsystem is initialized to ensure synchronous data transfer over a theoretically infinite range. The transmitting subsystem transmits data and a forwarded clock to the receiving subsystem. Data is captured in three state devices arranged in parallel to eliminate minimum delay requirements and to expand data valid time. The captured data is then aligned to the clock of the receiving subsystem by controlling a multiplexer which selects the proper state device output to pass to another state device for alignment to the receiving subsystem's clock. The multiplexer is controlled by a circuit which monitors the capturing of the incoming data and determines the correct state device output to select for proper data alignment.

Method and apparatus for realignment of synchronous data

An improved method for removing heat from electronic devices, such as computer modules, is described. A flow of gas, such as air, cools the components. The gas flow is sufficient to cool so called 'hot' components to their maximum operating temperature, and to cool the other components to their normal operating range. A liquid cooling system is also provided to cool the 'hot' components to their normal operating range.

Hybird cooling system for electronic components

The high-power, high-performance integrated circuit chip package comprises a chip constructed to contain top and bottom surfaces to which top and bottom metallization planes are fixed. Top and bottom heat sinks are fixedly mounted to the top metallization plane and bottom metallization plane, respectively. The metallization planes and heat sink combination functions as both a power lead and a heat dissipation means, allowing for the chip to contain signal connections which may be dedicated to input and output signal paths. The chip further comprises a plurality of contiguous top layers of thin dielectric material, at least one epitaxial layer on whichis mounted a plurality of transistors and associated circuitry, and at least one bottom layer of crystalline silicon material. The plurality of transistors and associated circuitry generates heat. Such heat may then be dissipated by following a first or second thermal path, the first path proceeding through the plurality of contiguous top layers, through the top metallization plane to the top heat sink and the second thermal path proceeding through at least one bottom layer through the bottom metallization plane to the bottom heat sink.

High-power, high-performance integrated circuit chip package

An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

Growing community of inventors

Shirley, MA, United States of America

Paul C Wade