Intel Corporation

Paul C George

James D Williams

Alexey Chinkov

Ravindranath Vithal Mahajan

Michael T Crocker

Paul J Gwin

Je-Young Chang

Sergio Antonio Chan Arguedas

Kuang C Liu

Kyle Jordan Arrington

Kelly P Lofgreen

Raanan Sover

Bradley H Smith

Linh M Le

Nir Peled

Jason Armstrong

Meir Cohen

An apparatus is described. The apparatus includes a controller to cause a volume of an ambient of a two phase immersion cooling system to be modulated. The ambient is to include a condenser that is to emit fluid warmed by vapor in the ambient. The vapor is to be generated by heat. The heat is to be generated by electronic devices that are to be immersed in a liquid bath. The controller is to cause the volume to increase in response to a first temperature of the fluid approaching a first lower limit. The controller is to cause the volume to decrease in response to a second temperature of the fluid approaching a second higher limit.

Two phase immersion cooling system with useable warmed liquid output

A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

Immersion cooling for integrated circuit devices

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Beaverton, OR, United States of America

Paul C George