E.i. Dupont De Nemours and Company

Other

Paul C Donohue

Kenneth Warren Hang

Michael J Haun

Vincent P Siuta

Sanford M Marcus

William A Craig

Michael F Barker

Colin R Pickering

A method of forming a distortion-free circuit whereby a conductive composition is applied to at least one layer of green ceramic tape. The conductive composition formulation is based on total composition, conductive powder selected from Ag, Pd, Pt and mixtures thereof and 0.5 to 1.5 wt. % boron; wherein a and b are dispersed in organic medium. The green tape formulation is, based on total composition, 25-50 wt. % glass composition comprising, based on mole %, 50-67% B,O,; 20-50% alkaline earth metal oxide; 2-15% rare earth oxide and 0-6% alkali metal oxide and 0-10% Al,O,; 50-75 wt. % refractory oxide and organic polymeric binder. The assemblage is fired to form a distortion-free circuit.

Method of forming distortion-free circuits

A glass composition comprising, based on mole %, 50-67% B.sub.2 O.sub.3 ; 20-50% M.sup.II O where M.sup.II is selected from the group consisting of alkaline earth elements; 2-15% Ln.sub.2 O.sub.3 where Ln is selected from the group consisting of rare earth elements and further comprising, based on mole %, 0-6% M.sup.I.sub.2 O where M.sup.I is selected from the group consisting of alkali elements and 0-10% Al.sub.2 O. The glass composition incorporated into a castable dielectric composition comprising a dispersion of finely divided solids comprising, based on solids: (a) 25-50 wt. % the glass composition; (b) 50-75 wt % refractory oxide; both dispersed in a solution of (c) an organic polymeric binder; and (d) a volatile organic solvent. The castable dielectric composition used in a method of forming a low loss green tape by casting a thin layer of the dispersion onto a flexible substrate and heating the cast layer to remove the volatile organic solvent.

Borate glass based ceramic tape

A lead and cadmium-free encapsulant glass composition consisting essentially of by weight %, 60-80% Bi.sub.2 O.sub.3, 6-14% SiO.sub.2, 5-12% B.sub.2 O.sub.3, 5-10% Al.sub.2 O.sub.3 and 0-4% ZnO.

Lead and cadmium-free encapsulant composition

A dielectric composition comprising an admixture of finely divided particles of

Dielectric composition containing kerf additive

An encapsulant composition comprising a lead zinc silicoborate glass which forms a crystalline phase of Zn.sub.2 SiO.sub.4 and ZnB.sub.2 O.sub.4 when it is fired at 650.degree.-800.degree. C.

Encapsulant composition

A dielectric glass composition consisting essentially on a molar basis of 15-27% ZNO, 8-16% BaO, 40-60% SiO.sub.2, 3-14% Al.sub.2 O.sub.3, 0-5% PbO and 0.5-5% of a metal oxide selected from ZrO.sub.2, up to 2.5% P.sub.2 O.sub.5 and mixtures thereof, the composition being crystallizable and non-reducing when fired at 850.degree.-900.degree. C.

Crystallizable glass and thick film compositions thereof

Thick film electronic compositions comprising finely divided particles of electrically functional material and a PbO-compatible inorganic binder dispersed in an organic medium in which 0.1 to 10.0% wt. lead nitrate is coated on the surface of at least one of the solide components.

Thick film electronic materials

A composition for the preparation of thick film resistors comprising an admixture of finely divided particles of a conductive metal hexaboride, glass inorganic binder which is substantially irreducible by the metal hexaboride and a small amount of finely divided silica.

Hexaboride resistor composition

Thick flim resistors and conductors compatible with copper and fireable in nonoxidizing atmosphere are provided. The resistors are based on certain hexaboride conductors such as LaB.sub.6 and glasses which are thermodynamically stable to or nonreducible by the hexaborides. Thick film pastes prepared with small particle size hexaboride and certain ethylene-vinyl acetate polymeric vehicles afford resistors having improved temperature coefficient of resistance and coefficient of variation.

Thick film copper compatible resistors based on hexaboride conductors

A high capacitance dielectric powder composition consisting essentially of finely divided particles of (a) 92-99% wt. BaTiO.sub.3 and (b) 8-1% wt. of a sintering aid consisting essentially of Pb or Li fluoride and optionally one or more oxides of Bi, Zn and Pb or precursors thereof.

Dielectric composition

A composition for the preparation of thick film resistors comprising an admixture of finely divided particles of a conductive metal hexaboride and a crystallizable glass frit which is irreducible by the metal hexaboride containing at least 5 mole % of Ta.sub.2 O.sub.5 which is reducible by the metal hexaboride under normal firing conditions.

A syrup of a magnesium compound is provided, which is screen printable onto a surface and pyrolyzable to form a MgO film thereon. The syrup contains solvent, organic magnesium compound dissolved in the solvent, and organic polymer thickener dissolved in the solvent.

Magnesium compositions and process for forming MGO film

Temperature coefficient of resistance (TCR) modifiers, useful in thick film resistor compositions, which can be fired in nonoxidizing atmosphere and which are based on LaB.sub.6 and glass powders dispersed in a vehicle, are provided. Among such TCR modifiers are included TiO, Ge, Si, and graphite.

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Wilmington, DE, United States of America

Paul C Donohue