Harris Corporation

Paul Brian Jaynes

Lawrence Wayne Shacklette

Philip Anthony Marvin

Louis Joseph Rendek, Jr

C W Sinjin Smith

Charles Michael Newton

Travis L Kerby

Louis J Rendek

Charles J Newton

C W Smith

Cw Sinjin Smith

A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic device may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

Method for making a three-dimensional liquid crystal polymer electronic device

A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air

A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with air, and positioning at least one biasing member in the membrane switch recess.

A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with a compressible dielectric material, and positioning at least one biasing member in the membrane switch recess.

Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch

An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods

A method for forming a circuit board is provided. The method includes forming a circuit board substrate () from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure () having a three dimensional contoured surface (). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate () is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate () is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.

Method of fabricating non-planar circuit board

A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.

Method and apparatus for sealing flex circuits made with an LCP substrate

A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.

Apparatus for sealing flex circuits having heat sensitive circuit elements

A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (). At least one circuit component can be attached to the surface of the LCP circuit ().

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Indialantic, FL, United States of America

Paul Brian Jaynes