Motorola Corporation

Paul Brazis

Daniel Roman Gamota

Jie Zhang

Krishna Kalyanasundaram

Steven Michael Scheifers

Jerzy Wielgus

Abhijit Roy Chowdhuri

Marc Kenneth Chason

Min-Xian M Zhang

Hakeem B Adewole

Organic field effect transistors (OFETs) can be created rapidly and at low cost on organic films by using a multilayer film () that has an electrically conducting layer () on each side of a dielectric core. The electrically conducting layer is patterned to form gate electrodes (), and a polymer film () is attached onto the gate electrode side of the multilayer dielectric film, using heat and pressure () or an adhesive layer (). A source electrode and a drain electrode () are then fashioned on the remaining side of the multilayer dielectric film, and an organic semiconductor () is deposited over the source and drain electrodes, so as to fill the gap between the source and drain electrodes and touch a portion of the dielectric film to create an organic field effect transistor.

Method of fabricating organic field effect transistors

An organic field effect transistor utilizes a bifunctional contact-enhancing agent at various interfaces to improve carrier mobility through the organic semiconductor layer, to improve carrier injection, and to enhance adhesion via a bifunctional mechanism. The contact-enhancing agent can be situated between the gate electrode () and the dielectric layer () to form a chemical or physical bond between the gate electrode and the dielectric layer. It can also be situated between the dielectric layer and the organic semiconducting layer (), or between the source and drain electrodes () and the organic semiconducting layer.

Organic contact-enhancing layer for organic field effect transistors

An organic semiconductor product state monitor attached to a product receives a product usefulness input, which, along with the product predetermined usefulness limit, is used to determine an indicator command to indicate a state of usefulness of the product. An organic circuit is formed and placed on a product with a power supply to control the circuit operation.

Organic semiconductor product state monitor

A wafer ( ) having integrated circuit elements formed therein is thinned and a first carrier ( ) is adhered thereto. The first carrier ( ) facilitates handling of the thinned wafer ( ). A second carrier ( ) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die ( ). Once the thinned die is mounted to a desired substrate ( ), the first carrier ( ) is readily removed. In one embodiment, the first carrier ( ) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.

Thinned semiconductor wafer and die and corresponding method

An integrated circuit ( ) that includes a field effect transistor ( ) is fabricated by forming an organic semiconductor channel ( ) on one substrate ( ), forming device electrodes ( ) on one or more other substrates ( ), and subsequently laminating the substrates together. In one embodiment, a dielectric patch ( ) that functions as a gate dielectric is formed on one of the substrates ( ) prior to performing the lamination. Lamination provides a low cost route to device assembly, allows for separate fabrication of different device structures on different substrates, and thins various device layers resulting in improved performance.

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South Elgin, IL, United States of America

Paul Brazis