Telefonaktiebolaget Lm Ericsson (publ)

Paul Asger Eriksen

Odd Steijer

Hans-Christer Moll

Jan-&angst;ke Engstrand

Jan-Ake Engstrand

Bengt Olof Lindstr&ouml;m

Christian Vieider

Goran Palmskog

Olle Larsson

Jan-ANGke Engstrand

Ivan Jonas

H&aring;kan Elderstig

Christer Moll

Mats Robertsson

Kristian R Engberg

Olle Jonny Hagel

Thomas Ericson

Mikael Persson

Göran Palmskog

Krister Fröjdh

Lennart Bäcklin

Lars Erik Lundstrom

Mats Granberg

Pia Tinghag

Jan ANGke Engstrand

Hans Moll

Mats Janson

Jan-Agne Svensson

Dragutin Tretinjak

Ulf Sven Olof Holm

Eva Ahlner

Josef Bakszt

Peter Lo Curizo

Phillip Peter Laubert

B&ouml;rje Rosborg

Lars Erik Pontus Lundstr&ouml;m

Ulf Holm

Christian Vjeider

Pontus Lundström

Krister Fröjd

The present invention is related to a method and device for precision and passive alignment such as precision and passive alignment technology for low cost array fibre access components. A laser carrier is passively aligned to an MT-interface using alignment structures on a replicated carrier. The laser carrier is based on a self-aligned semiconductor laser, flip-chip mounted on a silicon substrate with planar polymeric waveguides.

Method and device for passive alignment

An optocasule unit for an optohybrid assembly (), said capsule unit comprising a lower casing part () and a compatible upper cover part () which together form, at one end () thereof, an integral receptacle section for obtaining an optomechanical interface and receiving and detachably holding therein an optical connector with at least one external optical fiber. A central section () of the lower casing part () has a cavity () for receiving, in a form-closed manner, a ferrule () of the optohybrid assembly (). The lower casing part () has, at a second end thereof, a base plate () for supporting a substrate () having at least one optochip () and a proximal end of at least one primary optical fiber () mounted thereon. The cover part () also has a section () covering the substrate () and at least a portion of the base plate () of the lower part. The invention is also addressed to the lower casing part () of the optocapsule unit for enclosing an optohybrid assembly () therein, and to an optoelectronic module () comprising the capsule unit with an optohybrid assembly enclosed therein.

Optocapsule unit for an optohybrid assembly, a lower casing part of such an optocapsule unit, and an optoelectronic module comprising said optocapsule unit and an optohybrid assembly

The present invention relates to a spring clip for holding the connection sides of optical units in contact with one another, said optical units including guide pins and optical coupling surfaces. The clip includes a main part from which hooked members project out generally at right angles. A first and a second hooked member are adapted to snap firmly over a first optical unit, whereas a third hooked member is adapted to urge an optical connection side on a second optical unit against an optical connection side on the first optical unit.

Spring clip

A plastic encapsulated optomodule is provided which includes a leadframe, an optoelectric component, an electric component, and an optical connection interface integrated in the capsule. The electric component is connected electrically to the leadframe. The electric component and the optoelectric component are mutually connected electrically and the optoelectric component and the integrated connection interface are connected together via at least one optical waveguide. The electric component is provided on a first part of the leadframe and electric contact surfaces ( ) are provided on leads ( and ) in the leadframe ( ). The optoelectric component is provided on a second part of the leadframe and the optical connection interface arranged on an optodevice is connected to a third part of the leadframe. The optodevice is aligned by alignment elements provided on the leadframe and the leadframe includes alignment elements that conform with corresponding alignment elements on a plastic-encapsulation mold tool.

Optomodule

The present invention relates to an angled opto-mechanical connector ( ) and to a manufacturing process for the same. The connector ( ) comprises a fixture ( ) with straight and parallel grooves ( ) of two sizes running on the upper side of the fixture ( ) from a first fixture side ( ) to a second fixture side ( ). A lid ( ) is fastened above the fixture ( ). Fibre ends ( ) of optical fibres ( ) are placed in the capillaries which are formed between the smaller grooves ( ) of the fixture and the lid ( ) in such a way that they stick out through the side of the fixture ( ). A plastic capsule ( ) encloses the fixture ( ), the lid ( ) and the fibres ( ) completely or partially. The fibres ( ) stick out from the plastic capsule ( ) in a direction separated from that defined by the grooves of the fixture. The connector ( ) can also have an opto-mechanical interface of the above mentioned type at its other end ( ).

Angled opto-mechanical device

In encapsulating an optocomponent, a leadframe is used for the electrical connection of the component, the leadframe having a flag, to which the main body of the optocomponent is attached. The flag is located asymmetrically at an outer edge of the leadframe and is, in the encapsulating operation, placed close to a sidewall in a mold cavity in a mold. In this way, an optical interface of standard type can be obtained in the wall of the capsule. Further, the flag is flexibly attached, by zigzag-shaped bridges, to other portions of the leadframe so that the flag and thus the optocomponent will have a possibility to be resiliently and flexibly displaced a little at the positioning thereof in the mold cavity in the mold in relation to the other portions of the leadframe, in particular to its outer frame portions and bridge portions. By designing the zigzag-shaped bridges with a suitably adapted width and thickness a controlled elastic restoring force acting on the flag can be obtained and thus on the optocomponent so that it can be pressed and firmly retained in engagement with a positioning device for the optocomponent.

Leadframe for an encapsulated optocomponent

In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity in a mold half and the optocomponent is placed in the cavity in the mold, so that the guide pins are engaged in the guide grooves and ar accurately inserted therein. To achieve this effect, a resilient or elastic force such as from plunger is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity in the mold. The elastic force can also be obtained directly from a leadframe, to which the optocomponent is attached for electrical connection, or from a small elastic part placed in the cavity in the mold, this part then remaining in the capsule.

Injection of encapsulating material on a optocomponent

A method and arrangement for aligning a waveguide connector to at least one optical device is set forth. The arrangement includes a waveguide connector and a substrate carrying at least one waveguide. The waveguide connector having both guide legs and aligning elements. The method includes the step of shaking the arrangement at a frequency and amplitude sufficient to cause opposing aligning elements disposed on the waveguide connector and on the substrate to engage each other.

Waveguide connector

In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity of a mold half and the optocomponent is placed in the cavity of the mold, so that the guide pins are engaged in the guide grooves and are accurately inserted therein. To achieve this effect, a resilient or elastic force, such as from a plunger, is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity of the mold. The elastic force can also be obtained directly from a leadframe, to which the optocomponent is attached for electrical connection, or from a small elastic part, placed in the cavity of the mold.

Injection of encapsulating material on an optocomponent

An encapsulated optocomponent has an optocomponent assembly having an optical interface at one side, which has guide pins for positioning a connected optical component or optical connector. The assembly is attached to the outermost portion of a flexible tongue, which is an integral part of a dielectric carrier such as a polymer carrier. On or inside the carrier and the tongue thereof electrical conductive paths are arranged which are connected to the optoassembly and to electrical driver circuits in a driver circuit assembly, so that the carrier also has the function of a conventional lead frame. The entire device is molded into encapsulating plastic material. In the molding operation the positioning of the optoassembly in an accurately determined position and the retainment thereof in this position is facilitated by the flexibility of the tongue, not being affected for example by the fact that an injected encapsulating material may possibly displace the significantly larger driver circuit assembly and its attachment area on the carrier. This construction can also allow that only the optoassembly is encapsulated, the driver circuit assembly being protected in some other way, so that the flexible tongue is exposed. This design can facilitate the accurate positioning of the optocomponent assembly on a circuit board.

Encapsulation of transmitter and receiver modules

The present invention relates to a manufacturing method for an opto-mechanical connector (,) and to the connector itself. The invention includes that a fixture (,) is manufactured with straight and parallel grooves (,) running on the upper side of the fixture (,) from a first fixture side (,) to a second fixture side (,), and which grooves (,) are intended partly for optical fibers and partly for guide pins. A lid (,) is attached above the fixture (,), whereafter optical fibers (,) from, for example, a fiber ribbon cable (,) are introduced into the grooves (,) intended for the fibers from the first fixture side (,) so that the fiber ends (,) extend out through the second fixture side (,). Guide pins (,) are furthermore introduced into the grooves (,) intended for the guide pins. The structure obtained (fixture (,), lid (,), fiber ends (,) and guide pins (,)) is completely or partially enclosed by a plastic capsule (,).

Opto-mechanical device

Optocomponent capsule having an optical interface

The optoelectrical components which up to now have been used in the fibre-optical region have had waveguides of quartz and glass with hermetic encapsulating, which components have had too high manufacturing costs for profitable use. Through making polymeric single mode (SM) waveguides from plastic, for example, benzocyclobutene polymer (BCB) a simple reliable and inexpensive concept for making waveguides can be obtained. Two of the commercially available grades of BCB/DOW Chemicals have furthermore a refractive index difference which permits manufacturing of buried waveguides with SM characteristics. These two types of BCB material have shown themselves to be especially usable for manufacturing of so-called buried SM waveguides: a heat curable grade (1,4) used for under- and over-cladding for waveguides and a photo-definable derivative (3) used as the waveguide material. Encapsulating of a waveguide chip can in this way be made with plastics, at the same time as the connector interface can be formed in the end surfaces of the components.

Method for manufacturing an optoelectrical component and an

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Skogsvigen, Sweden

Paul Asger Eriksen