International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Paul Andrew Wormsbecher

Dean Frederick Herring

Tony Carl Sass

Daniel Paul Kelaher

Norman Bruce Desrosiers

Michael D French

Richard M Barina

Jeremy Scott Bridges

John Paul Scavuzzo

John Geoffrey Gundlach

Alvin G Davis

Michael Raymond Miller

William Mark Megarity

Glenn Edward Myrto

April E Ruggles

Peter A Smith

John Henry Sherman

Walter Adrian Goodman

David Lee Hager

Charles R Hatton

Brian Alan Trumbo

Michael Sven Miller

Edward John McNulty

David J Podmajersky

Frank V Grebe

Jimmy Grant Foster, Sr

Howard Victor Mahaney, Jr

Gregory Joseph McKnight

Larry G Pymento

Michael Dudley French, Jr

Christopher J Hardee

Vinod Kamath

Brian Michael Kerrigan

Camillo Sassano

Eric Allen Stegner

Robert William Stegner

Timothy Andreas Meserth

Jonathan Randall Hinkle

Michael Sean June

Karl Klaus Dittus

David John Jensen

Derek Ian Schmidt

Kevin S D Vernon

Sumanta Kumar Bahali

Eric T Gamble

Timothy M Wiwel

Kevin Duane Johnson

Cynthia Michelle Grosser

Diane S Busch

George T Brown

Mark S Bohannon

John Gary Bulluck

Julian Dominick Rizzi

Dennis P Reynolds

Edward Richard Ritinski

Mary F George

Norman Bruce Desroslers

Jason Michael Campbell

Yi-Lung Wu

Angela Lopez

Jerry Lee Gunter

David R Hermansen

Vincent M Coppola

An apparatus includes a fan having a fan housing with guidance members extending from opposing sides of the housing, wherein the fan housing has a depth that is less than a height and width. A handle is pivotably coupled to the fan housing, and guidance tracks are positioned on opposing sides of an open channel. Each of the guidance tracks has a first track portion extending from a first face of a chassis in a first direction into the chassis and a second track portion extending from the first track portion in a second direction. The guidance members move along the corresponding guidance tracks, wherein the fan housing moves along the first track portion in a sideways orientation and reaches an operating orientation in the second track portion.

Cooling fan assembly and guidance track for installing and removing a cooling fan

A product, according to one embodiment, includes a support portion, the support portion being elongated in a first direction; and an insertion portion extending from the support portion in a second direction orthogonal to the first direction, the insertion portion having dimensions allowing insertion of the insertion portion in a card connector of a circuit board. At least an exterior of the insertion portion is electrically insulating. The support portion is wider than the insertion portion in a third direction orthogonal to each of the first and second directions.

Card stabilizer bracket

Dual sided latching retainers including a latching mechanism fixing the dual sided latching retainer to a computer board assembly; a first module retention feature configured to receive a first computer module held between the first module retention feature and a first module support surface, wherein the first module retention feature holds the first computer module against a first side of the computer board assembly; a second module retention feature configured to receive a second computer module held between the second module retention feature and a second module support surface, wherein the second module retention feature holds the second computer module against a second side of the computer board assembly.

Dual sided latching retainer for computer modules

A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

Land grid array interconnect formed with discrete pads

A computer program product includes a computer readable storage medium having program instructions embodied therewith and executable by a processor to cause the processor to perform a method. The method includes a three-dimensional printer printing a first layer of an object onto a surface that is not part of the three-dimensional printer, wherein the first layer is printed while a printing platform of the three dimensional printer is in a first position. The printer is autonomously repositioned in a second position elevated above the first position by being supported either on the three-dimensional object itself or on a scaffold printed separate from the object. The printer prints a second layer of the three-dimensional object onto the first layer of the three-dimensional object while the printing platform is in the second position. The printer may have a plurality of legs for controllably repositioning the printing platform.

Three-dimensional printer having an expandable envelope

A split chassis with a floating midplane carrier is provided. The split chassis is a modular electronic chassis which includes a first chassis section and a midplane carrier floatingly mounted to the first chassis section. The modular electronic chassis further includes a second chassis section mounted to the first chassis section, with the midplane carrier mounted between the first chassis section and the second chassis section.

Modular chassis with floating midplane carrier

A server chassis, including: a first compartment configured to receive one or more central electronics complexes ('CECs'); and a second compartment configured to receive one or more fans for cooling the one or more CECs, wherein the second compartment is coupled to the first compartment such that: the second compartment is inserted within the first compartment when the second compartment is in an operational position; and the second compartment is outside of the first compartment and rotated relative to the first compartment when the second compartment is in a service position.

Central electronics complex ('CEC') and fan structure

A system, according to one embodiment, includes a first end having several first contacts configured for coupling with a circuit board, a second end oriented about orthogonal to the first end, and a plurality of leads connecting the first and second contacts. The second end has a plurality of second contacts configured for coupling directly with a card edge of an electronic device. The orientation of the second end relative to the first end is fixed. A system, according to another embodiment, includes a circuit board, a plurality of such connectors.

Orthogonal card edge connector

One embodiment of the present invention provides a method of three-dimensional printing. The method includes a three-dimensional printer printing a first layer of an object onto a surface that is not part of the three-dimensional printer, wherein the first layer is printed while a printing platform of the three dimensional printer is in a first position. The printer is autonomously repositioned in a second position elevated above the first position by being supported either on the three-dimensional object itself or on a scaffold printed separate from the object. The printer prints a second layer of the three-dimensional object onto the first layer of the three-dimensional object while the printing platform is in the second position. The printer may have a plurality of legs for controllably repositioning the printing platform.

A heatsink includes a rigid plate and a plurality of pin fins. The plate has a two dimensional array of holes through the rigid plate from a first face to a second face. Each pin fin is received in one of the holes and has a proximal end extending beyond the first face of the plate for conductively receiving heat, a distal end extending beyond the second face of the plate for convective heat exchange with air, a biasing member biasing the pin fin in a proximal direction, and a shoulder limiting the proximal extension of the pin fin through the hole. An apparatus may include the pin fin heatsink secured to a printed circuit board having at least two components that have different heights. Accordingly, each component is contacted by the proximal end of one or more self-adjusting pin fins that are aligned with the component.

Multi-component heatsink with self-adjusting pin fins

According to embodiments of the disclosure, assemblies, and methods for cable management are disclosed. The assembly may include a chassis and a cable management apparatus pivotably connected to the chassis. The chassis may have an interior compartment adapted to receive a first and second electronic component. The first electronic component may be adapted to connect to a first cable assembly and the second electronic component may be adapted to connect to a second cable assembly. The cable management apparatus may include a first bracket and second bracket supporting a management arm, the management arm may include two parallel planar bars, the bars fixedly attached together by one or more members perpendicular to the bars. The management arm may be adapted to support at least one of the first and second cable assemblies and may pivot between an operational position and a service position.

Pivoting cable management assembly

In an approach to analyzing audible alerts, one or more computer processors receive an audible alert originating external to a user. The one or more computer processors retrieve data related to the audible alert. The one or more computer processors analyze the data related to the audible alert. The one or more computer processors determine, based, at least in part, on the data related to the audible alert, a cause of the audible alert.

Method, computer program product and system for analyzing an audible alert

Two system boards may be connected by a blind plug connector assembly. The top system board supports a first connector and has a hole adjacent the first connector that secures a guide bracket. The blind plug connector assembly is selectively received in the guide bracket to position a proximal connector on the assembly for connecting to the first connector on the top system board and position a distal connector on the assembly for connecting to a second connector on the lower system board. A flexible wired connection extends within the assembly between the proximal connector and the distal connector, and may form a scalability cable. The interaction between the assembly and the guide bracket provide alignment of the connectors.

Vertical blindmate scaling of identical system boards

A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening.

Container-based data center having greater rack density

A memory module socket and a terminating resistor assembly. The terminating resistor assembly provides an elongate conductive bus bar and a plurality of conductive branches, wherein each conductive branch is in electronic communication with the elongate conductive bus bar through a resistor, wherein each conductive branch has a distal end disposed for contacting a signal pin within a memory module socket installed on a printed circuit board. A distal end of each conductive branch is inserted into a window on the connector shoulder adjacent to the slot of an empty memory module socket and engages a plurality of signal pins within the socket in response to the absence of a memory module in the slot. The plurality of signal pins engage contact pads on the memory module and are pushed out of contact with the conductive branch in response to the presence of a memory module in the slot.

Memory module socket with terminating apparatus

Growing community of inventors

Apex, NC, United States of America

Paul Andrew Wormsbecher