Micron Technology Incorporated

Micron Electronics, Inc.

Unisys Corporation

Round Rock Research, LLC

Other

Sun Microsystems, Inc.

Paul A LaBerge

Joe M Jeddeloh

Joseph M Jeddeloh

James Brian Johnson

A Kent Porterfield

Brent Keeth

Troy A Manning

Timothy B Cowles

Chris G Martin

Jim Rehmeyer

Jeffery W Janzen

Douglas Alan Larson

Jake Klier

Jeff W Janzen

Scott E Schaefer

Larry L Byers

Charles K Snodgrass

Jeffrey Jay Rooney

Gregory B Wiedenman

Jim M Dodd

Keith J Lunzer

Greg Wiedenman

Methods, systems, and devices for memory die fault detection using a calibration pin are described. A memory device may perform a calibration procedure on a first resistor of each of a set of memory dies of a memory module using a pin coupled with the memory module. The memory device may couple the pin to a second resistor of a memory die of the set of memory dies based on the memory die identifying a fault condition for the memory die executing one or more of multiple commands from the host device. The memory device may receive, from the host device, a command to read a register of one or more memory dies of the set of memory dies and may output, to the host device, an indication of the memory die that identified the fault condition based on coupling the pin to the second resistor.

Memory die fault detection using a calibration pin

Systems and methods disclosed herein include those that may receive a memory request including a requested memory address and may send the memory request directly to an address decoder associated with a stacked-die memory vault without knowing whether a repair address is required. If a subsequent analysis of the memory request shows that a repair address is required, an in-process decode of the requested memory address can be halted and decoding of the repair address initiated.

Switched interface stacked-die memory architecture

Systems and methods disclosed herein substantially concurrently transfer a plurality of streams of commands, addresses, and/or data across a corresponding plurality of serialized communication link interfaces (SCLIs) between one or more originating devices or destination devices such as a processor and a switch. At the switch, one or more commands, addresses, or data corresponding to each stream can be transferred to a corresponding destination memory vault controller (MVC) associated with a corresponding memory vault. The destination MVC can perform write operations, read operations, and/or memory vault housekeeping operations independently from concurrent operations associated with other MVCs coupled to a corresponding plurality of memory vaults.

Multi-serial interface stacked-die memory architecture

Embodiments of the present invention provide memory systems having a plurality of memory devices sharing an interface for the transmission of read data. A controller can identify consecutive read requests sent to different memory devices. To avoid data contention on the interface, for example, the controller can be configured to delay the time until read data corresponding to the second read request is placed on the interface.

Memory systems and methods for controlling the timing of receiving read data

Switched interface for stacked-die memory architecture with redundancy for substituting defective memory cells

A memory system and method uses stacked memory device dice coupled to each other and to a logic die. The logic die may include a timing correction system that is operable to control the timing at which the logic die receives signals, such as read data signals, from each of the memory device dice. The timing correction controls the timing of the read data or other signals by adjusting the timing of respective strobe signals, such as read strobe signals, that are applied to each of the memory device dice. The memory device dice may transmit read data to the memory device at a time determined by when it receives the respective strobe signals. The timing of each of the strobe signals is adjusted so that the read data or other signals from all of the memory device dice are received at the same time.

Memory system and method using stacked memory device dice, and system using the memory system

Memory systems, systems and methods are disclosed that may include a plurality of stacked memory device dice and a logic die connected to each other by through silicon vias. One such logic die includes an error code generator that generates error checking codes corresponding to write data. The error checking codes are stored in the memory device dice and are subsequently compared to error checking codes generated from data subsequently read from the memory device dice. In the event the codes do not match, an error signal can be generated. The logic die may contain a controller that records the address from which the data was read. The controller or memory access device may redirect accesses to the memory device dice at the recorded addresses. The controller can also examine addresses or data resulting in the error signals being generated to identify faults in the through silicon vias.

Method and apparatus for repairing high capacity/high bandwidth memory devices

A memory module includes several memory devices coupled to a memory hub. The memory hub includes several link interfaces coupled to respective processors, several memory controller coupled to respective memory devices, a cross-bar switch coupling any of the link interfaces to any of the memory controllers, a write buffer and read cache for each memory device and a read synchronization module. The read synchronization module includes a write pointer, a read pointer and a buffer. The write pointer is incremented in response to the receipt of read data. The read pointer increments in response to coupling of the read data from the memory hub. A comparator compares the read pointer an the write pointer, and the comparison is used to adjust the memory timing.

System and method for read synchronization of memory modules

Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on the same die or a different die. Other embodiments are described.

Stacked device remapping and repair

Memory systems, systems and methods are described that may include a plurality of stacked memory device dice and a logic die connected to each other by through silicon vias. One such logic die includes an error code generator that generates error checking codes corresponding to write data. The error checking codes are stored in the memory device dice and are subsequently compared to error checking codes generated from data subsequently read from the memory device dice. In the event the codes do not match, an error signal can be generated. The logic die may contain a controller that records the address from which the data was read. The controller or memory access device may redirect accesses to the memory device dice at the recorded addresses. The controller can also examine addresses or data resulting in the error signals being generated to identify faults in the through silicon vias.

Growing community of inventors

Shoreview, MN, United States of America

Paul A LaBerge