Intel Corporation

Paul A Koning

Ashay A Dani

Saikumar Jayaraman

Christopher L Rumer

Sabina J Houle

James Chris Matayabas, Jr

James Christopher Matayabas, Jr

Bryan M White

Greg M Chrysler

Daoqiang Lu

Eric Jin Li

Yuegang Zhang

C Michael Garner

Gudbjorg H Oskarsdottir

Tiffany Byrne

Darcy E Fleming

Fay Hua

Tian-An Chen

Terry Lee Sterrett

Paul H Wermer

Vijay Wakharkar

Agostino C Rinella

Valluri Ramana Rao

Gregory Martin Chrysler

Andrew A Berlin

Carl L Deppisch

Steven N Towle

Makarem A Hussein

Edward L Martin

Jinlin Wang

Salkumar Jayaraman

James Matayabas

Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.

Polymer matrices for polymer solder hybrid materials

Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.

Semiconductor wafer coat layers and methods therefor

An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.

Nanotube modified solder thermal intermediate structure, systems, and methods

Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.

Thermal intermediate apparatus, systems, and methods

An electronic assembly having a microelectronic die, a heat spreader and a heat sink. A first thermal interface material is disposed between the microelectronic die and the heat spreader. A second thermal interface material is disposed between the heat spreader and a heat sink. The first and second interface materials each comprising a phase change polymer, a solderable material and a plurality of thermally conductive non-fusible particles. The solderable material interconnecting the non-fusible particles to form a plurality of columnar structures within the phase change polymer.

Phase change material containing fusible particles as thermally conductive filler

An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.

Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly

Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.

Component packaging apparatus, systems, and methods

Liquid crystalline epoxy compounds, compositions including the compounds, and methods of using the compositions are disclosed. In one aspect, an epoxy compound may have a melting point that is less than 140&#xb0; C. and may be liquid crystalline at a temperature greater than 150&#xb0; C.

Microelectronic device having liquid crystalline epoxy resins

In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.

No-flow underfill composition and method

A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

Carbon-carbon and/or metal-carbon fiber composite heat spreader

A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied to the surface of the die not covered by the contact pad protective material and the underfill material is partially cured in a curing oven. The contact pad material is removed leaving openings over the respective surface of the contact pad. A one or more contacts on a package substrate is inserted into the openings, electronically connecting the contacts to the contact pads.

Wafer-level underfill process making use of sacrificial contact pad protective material

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Chandler, AZ, United States of America

Paul A Koning